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Fabrication of Silicon on Borosilicate Glass Microarrays for Quantitative Live Cell Imaging

Published online by Cambridge University Press:  13 July 2011

David T. Martin
Affiliation:
Departments of Electrical & Computer Engineering, University of California San Diego, 9500 Gilman Dr., La Jolla CA 92093.
Sergio Sandoval
Affiliation:
Departments of Bioengineering, University of California San Diego, 9500 Gilman Dr., La Jolla CA 92093.
Andy Carter
Affiliation:
Department of Electrical & Computer Engineering, University of California, Santa Barbara, CA 93106.
Mark Rodwell
Affiliation:
Department of Electrical & Computer Engineering, University of California, Santa Barbara, CA 93106.
Stefan Smith
Affiliation:
Departments of Mechanical & Aerospace Engineering, University of California San Diego, 9500 Gilman Dr., La Jolla CA 92093.
Andrew C. Kummel
Affiliation:
Departments of Chemistry & Biochemistry, Nanoengineering, University of California San Diego, 9500 Gilman Dr., La Jolla CA 92093.
Davorka Messmer
Affiliation:
Departments of Moores Cancer Center, University of California San Diego, 9500 Gilman Dr., La Jolla CA 92093.
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Abstract

Planar arrays of microwells were fabricated in Silicon on borosilicate glass (pyrex) substrates in order to facilitate live cell fluorescence imaging experiments for cells sequestered inside their own individual microenvironments for incubation and quantification of single cell seceretions. Two methods of deep silicon etching were compared: cryogenic deep reactive ion etching (DRIE) and time multiplexed DIRE (Bosch Process). A 200um Si wafer was bonded to a 500um pyrex substrate. Cryogenic DRIE allowed for the reliable fabrication of 75-100um deep microwells with 60x60um openings across a 10x10mm substrate while the Bosh Process allowed for etching entirely through the Si layer, producing 200um deep microwells with transparent bottoms and steep sidewalls while maintaining the target 60x60um opening geometry.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

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