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Cross Slip in Cu - A Molecular Dynamics Study

Published online by Cambridge University Press:  01 February 2011

Dan Mordehai ,
Guy Makov  and
Itzhak Kelson
Dan Mordehai
Affiliation:
School of Physics and Astronomy, The Raymond and Beverly Sackler Faculty of Exact Sciences, Tel Aviv University, Tel Aviv 69978, Israel.
Guy Makov
Affiliation:
Department of Physics, NRCN, PO.Box 9001, Be'er Sheva, Israel
Itzhak Kelson
Affiliation:
School of Physics and Astronomy, The Raymond and Beverly Sackler Faculty of Exact Sciences, Tel Aviv University, Tel Aviv 69978, Israel.
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Abstract

The annihilations of screw dislocation dipoles via cross-slip in Cu were simulated using constant-temperature constant-stress molecular dynamics. The cross-slip mechanism and annihilation process of flexible dislocations in a large dipole configuration was identified as a dynamic variant of the Friedel-Escaig mechanism. The cross-slip rate was found to exhibit exponential dependence on the temperature, from which the activation enthalpy for the cross-slip process was calculated by the Arrhenius relation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 882: Symposium EE – Linking Length Scales in the Mechanical Behavior of Materials , 2005 , EE7.2
Copyright
Copyright © Materials Research Society 2005

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