Hostname: page-component-8448b6f56d-sxzjt Total loading time: 0 Render date: 2024-04-24T01:54:11.694Z Has data issue: false hasContentIssue false

Laser Induced Oxidation of Heavily Doped Silicon*

Published online by Cambridge University Press:  26 February 2011

E. Fogarassy
Affiliation:
Centre de Recherches Nucléaires, Laboratoire Phase, 23, rue du Loess, F-67037 Strasbourg Cedex, FRANCE
C.W. White
Affiliation:
Solid State Div., Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA
D.H. Lowndes
Affiliation:
Solid State Div., Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA
J. Narayan
Affiliation:
Solid State Div., Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA
Get access

Abstract

We have investigated the incorporation of oxygen into heavily doped silicon during UV excimer laser irradiation. For the case of repetitive laser irradiations in air, we observe that the amount of oxygen incorporated into Si depends markedly on the dopant. For As and Sb implanted silicon, there is no anomalous oxygen incorporation. By contrast, increasing amounts of 0 are incorporated into In implanted silicon as a function of number of laser shots. The incorporation of 0 is associated with degradation of the optical and structural properties of the surface, and a deep diffusion of the dopant. This behavior is believed to be partly related to specific chemical reactions between oxygen and indium present in the surface at high concentrations as the result of dopant segregation during solidification.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

*

Research sponsored by the Division of Materials Sciences, USDOE under contract DE-ACO5-840R21400 with Martin Marietta Energy Systems, Inc.

References

REFERENCES

1) Gibbons, J.F., Jpn J. Appl. Phys. Suppl. 19, 121 (1980).Google Scholar
2) Boyd, I.W. and Wilson, J.I.B., Thin Solid Film, 83, L173 (1981).Google Scholar
3) Boyd, I.W. and Wilson, J.I.B., Appl. Phys. Lett. 41, (2), 162 (1982).CrossRefGoogle Scholar
4) Schafer, S.A. and Lyon, S.A., J. Vac. Sci. Technol., 19, 494 (1981).CrossRefGoogle Scholar
5) Hoh, K., Koyama, H., Uda, K., and Miura, Y., Jpn J. Appl. Phys. 19, 7, L375 (1980).Google Scholar
6) Liu, Y.S., Chiang, S.W., and Bacon, F., Appl. Phys. Lett. 38 (12) 1005 (1981).Google Scholar
7) Orlowski, T.E. and Richter, H., Appl. Phys. Lett. 45 (3), 241 (1984).Google Scholar
8) Baeri, P., Campisano, S.U., Foti, G., and Rimini, E., Appl. Phys. Lett. 33 (2), 137 (1978).Google Scholar
9) Trumbore, F., Bell Syst. Techn. J. 39, 205 (1960).Google Scholar
10) White, C.W., Laser and Electron Beam Interactions with Solids, edited by Appleton, B.R. and Celler, G.K. (North Holland, 1982) p. 109.Google Scholar
11) Aziz, M. (private communication).Google Scholar
12) Poate, J.M., Laser and Electron Beam Interactions with Solids, edited by Appleton, B.R. and Celler, G.K. (North Holland, 1982) p. 121.Google Scholar