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Relation Between Macro- and Microstress in Thin Metallic Layers

Published online by Cambridge University Press:  10 February 2011

Léon J. Seijbel  and
Rob Delhez
Léon J. Seijbel
Affiliation:
Laboratory for Materials Science, Delft University of Technology, Rotterdamseweg 137, NL-2628 AL Delft, Netherlands, L.J.Seijbel@stm.tudelft.nl
Rob Delhez
Affiliation:
Laboratory for Materials Science, Delft University of Technology, Rotterdamseweg 137, NL-2628 AL Delft, Netherlands, L.J.Seijbel@stm.tudelft.nl
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Abstract

X-ray diffraction has been used to measure the stress in thin nickel films. In addition to the stress value, information is obtained about the elastic interaction between grains. Various models exist to calculate the stress from the strain. A model that uses the mechanical elastic constants has been used. From this model it can be concluded that the model by Hill is applicable for the layers analyzed. Annealing experiments between 300 and 500 K show that the initially present growth stress reduces to zero at 500 K. The microstrain inside the grains is obtained from the broadening of the diffraction lines measured. During annealing the diffraction lines narrow. This is caused by two effects: grain growth and reduction of the dislocation density.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 99
Copyright
Copyright © Materials Research Society 2000

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References

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