Hostname: page-component-8448b6f56d-c47g7 Total loading time: 0 Render date: 2024-04-19T21:53:23.102Z Has data issue: false hasContentIssue false

Preparation of Conductive Tungsten Carbide Layers for SiC High Temperature Applications

Published online by Cambridge University Press:  10 February 2011

H. Romanus
Affiliation:
Institute of Physics, Technical University of Ilmenau, Germany, D-98693 Ilmenau
V. Cimalla
Affiliation:
Institute of Physics, Technical University of Ilmenau, Germany, D-98693 Ilmenau
S. I. Ahmed
Affiliation:
Institute of Physics, Technical University of Ilmenau, Germany, D-98693 Ilmenau
J. A. Schaefer
Affiliation:
Institute of Physics, Technical University of Ilmenau, Germany, D-98693 Ilmenau
G. Ecke
Affiliation:
Institute of Solid State Electronics, Technical University of Ilmenau, Germany
R. Avci
Affiliation:
Department of Physics, Montana State University, Bozeman, Montana 59717
L. Spiess
Affiliation:
Institute of Materials Engineering, Technical University of Ilmenau, Germany
Get access

Abstract

Thin tungsten carbide films of different compositions were prepared by DC magnetron sputtering of tungsten and carbon and subsequent annealing in different environments. The onset of carbide formation was around 800°C. Annealing in a pure hydrogen ambient generally results in carbon depletion in the layers with the formation of a dominant W2C phase. Adding propane enhances the carbon content in the layers and stimulates the formation of the WC phase. On silicon nitride substrates, variation of the propane concentration in an annealing environment allows a continuous alteration of the layer structure between polycrystalline single phase WC and a mixed layer with dominant W2C and with it, the adjustment of different values of the electrical resistance. In contrast, on thin (100)SiC layers a textured W2C phase was grown after annealing in propane/hydrogen at 900°C whereas at higher temperatures the formation of silicides was observed. In addition, the chemical composition and the temperature dependence of the electrical specific resistance were investigated and are also discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Palmour, J. W., Lipkin, L. A., Singh, R., Slater, D. B., Suvorov, A.V., Carter, C. H. Jr, Diam. Rel. Mater. 6, 1400–4 (1997).10.1016/S0925-9635(97)00118-0Google Scholar
[2] Chelnokov, V. E., Syrkin, A. L., Dmitriev, V. A., Diam. Rel. Mater. 6, 1480–4 (1997).10.1016/S0925-9635(97)00120-9Google Scholar
[3] Porter, L. M., Davis, R. F., Mater. Sci. Eng. B (Solid-State Materials for Advanced Technology) 34 (2–3), 83105 (1995).10.1016/0921-5107(95)01276-1Google Scholar
[4] L., SpieB; O, Nennewitz; H., Weishart; J., Lindner; W., Skorupa; H., Romanus; F., Erler; J., Pezoldt: Aluminum implantation of p-SiC for Ohmic contacts; Diam. Rel. Mater. 6, 1414–8 (1997).Google Scholar
[5] Carbide, Nitride and Boride Materials - Synthesis and Processing, edited by Weimer, A. W., Chapman & Hall, London, (1997).Google Scholar
[6] Bichli, A., Chen, J. S., Ruiz, R.P., Nicolet, M.A., MRS Symp. Proc. 339,247–52 (1994).10.1557/PROC-339-247Google Scholar
[7] Tägtström, P., Högberg, H., Jansson, U., Carlsson, J. O., J. de Phys. IV, 5 (C5, pt.2) 967–74 (1995).Google Scholar
[8] Cimalla, V., Karagodina, J.K., Pezoldt, J., Eichhorn, G., Mater. Sci. Eng. B29, 170175 (1994).Google Scholar
[9] Leitz, G., Pezoldt, J., Patzschke, I., Zillner, J.-P., Eichhorn, G., MRS Symp. Proc. 303, 171176 (1993).10.1557/PROC-303-171Google Scholar
[10] Practical Surface Analysis, edited by D., Briggs and M.P., Seah, John Wiley & Sons, New York, (1990).Google Scholar