Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-16T18:57:13.339Z Has data issue: false hasContentIssue false
  • English
  • Français

Annealing Effects on the Microstructure and Mechanical Properties of Liga Nickel for Mems

Published online by Cambridge University Press:  17 March 2011

H. S. Cho ,
W. G. Babcock ,
H. Last  and
K. J. Hemker
H. S. Cho
Affiliation:
Departments of Mechanical Engineering and Materials Science and Engineering, The Johns Hopkins University, Baltimore, MD 21218, USA
W. G. Babcock
Affiliation:
IIT Research Institute, 201 Mill St., Rome, NY 13440; Formerly with Naval Surface Warfare Center, Indian Head Division, Indian Head, MD 20640
H. Last
Affiliation:
Institute for Defense Analyses, Alexandria, VA 22311, USA
K. J. Hemker
Affiliation:
Departments of Mechanical Engineering and Materials Science and Engineering, The Johns Hopkins University, Baltimore, MD 21218, USA
Get access

Abstract

The emergence of elevated temperature applications for microelectomechanical systems (MEMS) has resulted in the need for an understanding of the relation between the microstructural stability and the mechanical properties of their structural elements. Hardness and tensile tests and microstructural observations have been conducted with as-deposited and annealed conditions of LIGA-Ni microsamples that were deposited with current densities of 6mA/cm2 and 50mA/cm2. The Young's modulus was found to be independent of the annealing temperature, but the hardness and yield strength decreased dramatically at temperatures above 400°C. The microsamples deposited at a current density of 6mA/cm2 showed much higher strength and hardness than those deposited at 50mA/cm2. This increased strength has been related to the observation that the microstructure of the 6mA/cm2 microsamples is much finer than was observed for 50mA/cm2.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 657: Symposia EE – Materials Science of Microelectromechanical Systems (MEMS) Devices III , 2000 , EE5.23
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Spearing, S.M., Acta mater. 48, (2000) 179–196.Google Scholar
2. Madou, Marc J., Fundamentals of Microfabrication, CRC press, (1997).Google Scholar
3. Safranek, William H., The Properties of Electrodeposited Metals and Alloys, 2nd ed., American Electroplaters and Surface Finishers Society, Orlando, Florida, (1986) 253–325 Google Scholar
4. Jacobson, B. E. and Sliwa, J. W., Plating and Surface Finishing 66 (1979) 42–47.Google Scholar
5. Christenson, T. R., Buchheit, T. E., Schmale, D. T. and Bourcier, R. J., Mater. Res. Soc. Proc. 518, (1998) 185–190.Google Scholar
6. Singh, V. B. and Sarabi, R. Sadeghi, Surface Engineering 9 156–160 (1993); Materials Science and Technology 11 (1995) 317-321.Google Scholar
7. Xie, Z. L., Pan, D., Last, H. and Hemker, K. J., Mater. Res. Soc. Proc., 605, (1999) 197–202.Google Scholar
8. Fan, L., Last, H., Wood, R., Dudley, B., Howe, R., Johnson, G., Krulevitch, P. and Muhlstein, C., Microsystems Technologies, 4 (1998) 168–171.Google Scholar
9. Sharpe, W. N. Jr., NASA Report No. 101638 (1989).Google Scholar
10. Hemker, K. J. and Last, H., Mater. Sci. & Eng., in press (2000).Google Scholar
11. Metals Handbook, 10th Edition, 2, ASM International (1990).Google Scholar
12. Dirras, G., private communication (2001).Google Scholar
13. Banovic, S. W., Barmak, K. and Marder, A. R., J. of Materials Science, 33 (1998) 639–645.Google Scholar