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Foamed Elastomers For Packaging Interconnections, Testing And Burn‐In Applications

Published online by Cambridge University Press:  10 February 2011

Y. Liao ,
D.Y. Shih ,
J.L. Hedrick ,
P.A. Lauro  and
K.E. Fogel
Y. Liao
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY 10598, yhliao@watson.ibm.com
D.Y. Shih
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY 10598, yhliao@watson.ibm.com
J.L. Hedrick
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
P.A. Lauro
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY 10598, yhliao@watson.ibm.com
K.E. Fogel
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY 10598, yhliao@watson.ibm.com
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Abstract

The present study is directed to a new foamed elastomer composition for supporting the interconnecting conductive wires in the Elasticon™ interposer connector for the packaging interconnections, test and burn‐in applications. The compressibility of interposer connector can be tailored by introducing controlled volume fraction of foam into elastomer or filled elastomer. The foamed elastomer has been successful applied to a new Ball Grid Array (BGA) module testing socket to meet the contact force requirement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 95
Copyright
Copyright © Materials Research Society 1997

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References

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