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Future Packaging Directions in the 1990's and their Materials Challenges

Published online by Cambridge University Press:  21 February 2011

Dean E. Eastman*
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, NY 10598, USA
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Abstract

In the 1990's, silicon integrated circuit technology will continue to rapidly advance from VLSI towards ULSI. For example, 64 × 106 circuit microprocessor chips, 106 gate CMOS logic chips, and 105 circuit bipolar logic chips, and beyond, will make up the electronics systems of the 1990's. To support these silicon technology advances in density, performance, and cost reduction, packaging technology will also have to advance rapidly to meet packaged electronics systems requirements. Packaging solutions will be required for machines ranging from supercomputers and mainframes to minis and workstations, and for consumer electronics. Silicon technology advances will continue to enable the unique rates of change in performance, function, and cost per function that characterize the information technology industry, including the computer, communications, and consumer electronics industries.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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