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An Experimental and Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder Joints

Published online by Cambridge University Press:  15 February 2011

Y.-H. Pao ,
S. Badgley ,
R. Govila  and
E. Jah
Y.-H. Pao
Affiliation:
Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053
S. Badgley
Affiliation:
Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053
R. Govila
Affiliation:
Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053
E. Jah
Affiliation:
Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053
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Abstract

Thermal cyclic shear stress/strain hysteresis response of 97Sn-2Cu-0.8Sb-0.2Ag, 95.5Sn-4Cu-0.5Ag, 63Sn-37Pb, and 62Sn-36Pb-2Ag solder joints have been determined using a double beam specimen. The temperature cycle had a period of 40 minutes and extreme temperatures of 40°C and 140°C.The steady state creep properties of these solders were determined, and the associated Norton's law was implemented in a finite element program to simulate the experiment. The fatigue life of these solders joints and failure mechanism are also discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 153
Copyright
Copyright © Materials Research Society 1994

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