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Patterned Macrovoids for Dielectric Constant Control of High Frequency Circuit Substrates

Published online by Cambridge University Press:  25 February 2011

M. Kahn  and
B. Kriese
M. Kahn
Affiliation:
Naval Research Laboratory Washington, D.C. 20375-5000
B. Kriese
Affiliation:
Naval Research Laboratory Washington, D.C. 20375-5000
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Abstract

Fugitive ink and tape technology permit the inclusion of flat voids at predetermined locations in ceramic microcircuit substrates. Calculations show that critical stray capacitances can be reduced by as much as 65% and the propagation delay of microstrip transmission lines by 30% and more. The selectivity of the void location permits the retention of the full thermal conductance of the substrate under heat dissipating elements.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 35
Copyright
Copyright © Materials Research Society 1986

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References

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