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Silicon Field Emitter Array by Fast Anodization Method

Published online by Cambridge University Press:  14 March 2011

Y.M. Fung
Affiliation:
Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong, P. R. China
W.Y. Cheung
Affiliation:
Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong, P. R. China
I.H. Wilson
Affiliation:
Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong, P. R. China
J.B. Xu
Affiliation:
Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong, P. R. China
S.P. Wong
Affiliation:
Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong, P. R. China
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Abstract

A new fast fabrication method entailing, two step anodization of silicon with different HF solutions was used to form a high aspect ratio silicon Field Emitter Array on n-type silicon (resistivity of 0.01cm). A Silicon oxide mask was used to define the field emitter array. The silicon substrate was pre-anodized with low current density for 1 minute in the dark and then anodized in HF:H2O:Ethanol solution. Finally, the porous silicon was removed by isotropic solution etching. The turn-on voltage of the fabricated field emitters was approximately 27V/μm when the emission current density reaches 1μA/cm2. This compares with the turn-on field of about 35V/μm on silicon tip array fabricated by using an isotropic etching solution of HNO3. We obtained field emitter arrays with good uniformity and reproducibility.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

[1] Turner, D.R., J. Electrochem. Soc. 105 (1958) 402408.Google Scholar
[2] Smith, R.L., Collins, S.D., J.Appl. Phys. 71(8) (1992) R1–R22.Google Scholar
[3] Imai, K., Solid-State Electronics, 24 (1981) 159164.Google Scholar
[4] Frye, R.C., Proc. Material Res. Soc. Symp., Vol. 33 (1984) 5362.Google Scholar
[5] Anderson, R.C., Muller, R.S. and Tobias, C.W., J. of Electroelectromechanical Systems, 3(1) (1994) 1018.Google Scholar
[6] Higa, K., Nishii, K. and Asano, T., J. Vac. Sci. Technol. B16(2) (1998) 651652.Google Scholar
[7] Jessing, J.R., Kim, H.R., Parker, D.L. and Weichold, M.H., J. Vac. Sci. Technol. B16(2) (1998) 777779.Google Scholar
[8] Hamilton, B., Semicond. Sci. Technol. 10 (1995) 1187.Google Scholar
[9] Hubbard, T.J., Antonsson, E.K., J. of Electroelectromechanical Systems, 3(1) (1994) 1928 Google Scholar
[10] Ziel, A. van der, Solid State Physical Electronics (Prentice-Hall, Engle-wood Cliffs, NJ, (1968) 164.Google Scholar
[11] Chen, D., Wong, S.P., Cheung, W.Y., Wu, W., Luo, E.Z., Xu, J.B., Wilson, I.H. and Kwok, R.W.M., Appl. Phys. Lett. 72(15) (1998) 19261928.Google Scholar