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Stress Modification in Tungsten Films Deposited by Ion-Assisted Evaporation

Published online by Cambridge University Press:  25 February 2011

R. A. Roy ,
R. Petkie ,
D. S. Yee ,
J. Karasinski  and
A. Boulding
R. A. Roy
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
R. Petkie
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
D. S. Yee
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
J. Karasinski
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
A. Boulding
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
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Abstract

The modification of film stress in evaporated tungsten was studied as a function of deposition environment. Using concurrent ion bombardment of the growing film, the stress was seen to vary systematically with ion energy, ion flux, and substrate temperature. The qualitative behavior fits the model of stress modification developed for niobium films. X-ray diffraction was used to study the structure of the films, and a clear correlation between crystallographic texture and film stress is found. The original structure/impurity model for film stress modification due to ion bombardment has been modified to account for the relationship between film stress and texture.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 128: Symposium A – Processing and Characterization of Materials Using Ion Beams , 1988 , 17
Copyright
Copyright © Materials Research Society 1989

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References

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