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A New Polyimide for Multi-Chip Modules Applications

Published online by Cambridge University Press:  21 February 2011

Hidetaka Satou
Affiliation:
Hitachi Chemical Co., Ltd.Yamazaki Works 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
Daisuke Makino
Affiliation:
Hitachi Chemical Co., Ltd.Yamazaki Works 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
Toru Kikuchi
Affiliation:
Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
Takayuki Saito
Affiliation:
Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
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Abstract

Currently polyimides are used for a multitude of applications in the electronics field. No where else is it's use growing faster than in the multi-chip module market. It's inherent features in process ability, planarity, heat resistance, and patternability make it ideal for production use in multi chip modules.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

[1] Numata, S. et al, Polym. Prep. Jap., Vol.33, No.9, 2423 (1984)Google Scholar
[2] Numata, S. et al, Polyimides Vol.1, p.259, Plenum Press (1984)Google Scholar