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Materials Science and Processing, the Foundation of Packaging

Published online by Cambridge University Press:  22 February 2011

D. E. Eastman*
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY 10598
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Extract

Electronic package systems for information processing include the functions of electrical interconnection, cooling and physical support for the sets of IC chips plus other components in electronic systems. There are several distinct packaging technology worlds, ranging from that of the large high performance mainframe systems to that of the supermini and to that of the small workstation or home computer. In all cases, the package system is a major cost factor; for high performance systems, it is also a major performance factor.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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