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Fracture Strength of Polysilicon thin Films at Stress Concentrations

Published online by Cambridge University Press:  15 March 2011

J. Bagdahn  and
W. N. Sharpe Jr.
J. Bagdahn
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, 3400 N. Charles Street, Baltimore MD 21218-2681, U.S.A.
W. N. Sharpe Jr.
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, 3400 N. Charles Street, Baltimore MD 21218-2681, U.S.A.
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Abstract

The fracture strengths of 3.5 microns thick and 20 or 50 microns wide polysilicon specimens were measured. One set of specimens was straight in the gage section, another set had a central hole 5.0 microns in diameter, and the third set had symmetric semicircular notches 2.5 microns in radius on each side. The local maximum fracture stresses of the non- uniform specimens, as calculated from the remote fracture stress with a stress concentration factor, were higher than measured in the straight specimens. This indicates a size effect, which is presumably due to the smaller highly stressed volume or area in the non-uniform specimens.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 687: Symposium B – Materials Science of Microelectromechanical Systems (MEMS) Devices IV , 2001 , B9.7
Copyright
Copyright © Materials Research Society 2002

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