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Dicing of Fragile MEMS Structures

Published online by Cambridge University Press:  01 February 2011

Peter Lange ,
Norman Marenco ,
Sven Gruenzig ,
Stephan Warnat  and
Thilo Semperowitsch
Peter Lange
Affiliation:
peter.lange@isit.fraunhofer.de, Fraunhofer ISIT, MST, Itzehoe, Germany
Norman Marenco
Affiliation:
norman.marenco@isit.fraunhofer.de, Fraunhofer ISIT, AVT, Itzhoe, Germany
Sven Gruenzig
Affiliation:
sven.gruenzig@isit.fraunhofer, Fraunhofer ISIT, ICD, Itzehoe, Germany
Stephan Warnat
Affiliation:
stephan.warnat@isit.fraunhofer.de, Fraunhofer ISIT, AVT, Itzhoe, Germany
Thilo Semperowitsch
Affiliation:
semperowitsch@accretech.de, Accretech GmbH, Munich, Germany
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Abstract

Stealth dicing appears to be the appropriate methode to singulate surface sensitive microelectromechanical devices, without producing dicing debris or using water jet. The operating mode of the stealth dicing will be explained. A three dimensional integration project with open micromachined structures is taken as a reference to evaluate the advantages and limitations of this new dicing method. The preconditions for successful singulations will be discussed. Optical and SEM inspection results after successful separation will be discussed.

Keywords

microelectro-mechanical (MEMS)packagingmicrostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG01-09
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

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