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Low Thermal Expansion Polyimides and their Applications

Published online by Cambridge University Press:  21 February 2011

Shunichi Numata ,
Takao Miwa ,
Yutaka Misawa ,
Daisuke Makino ,
Junichi Imaizumi  and
Noriyuki Kinjo
Shunichi Numata
Affiliation:
Hitachi Research Laboratory, Hitachi, Ltd. 4026, Kuji-cho, Hitachi-shi, 319-12, Japan
Takao Miwa
Affiliation:
Hitachi Research Laboratory, Hitachi, Ltd. 4026, Kuji-cho, Hitachi-shi, 319-12, Japan
Yutaka Misawa
Affiliation:
Hitachi Research Laboratory, Hitachi, Ltd. 4026, Kuji-cho, Hitachi-shi, 319-12, Japan
Daisuke Makino
Affiliation:
Yamazaki Works, Hitachi Chemical Co., Ltd. 4-13-1, Higashi-cho, Hitachi-shi, 317, Japan
Junichi Imaizumi
Affiliation:
Goshomiya Works, Hitachi Chemical Co., Ltd. 1150, Goshomiya, Shimodate-shi, 308, Japan
Noriyuki Kinjo
Affiliation:
Hitachi Research Laboratory, Hitachi, Ltd. 4026, Kuji-cho, Hitachi-shi, 319-12, Japan
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Abstract

Thermal expansion coefficients (TECs) for polyimides differ very much depending on their chemical structures. Polyimdes with a rod-like structure as their backbone chains have lower TEC values. This is attributed to restraining of thermal expansion by rod-like molecules within intermolecular spaces, analogous to glass fibers in FRPs. The development of new polyimides which can closely match TECs of inorganic materials, such as metal or Si, can eliminate problems produced by thermal stress including warping, cracking or delamination.

A new multilevel interconnection system using multilayered dielectrics consisting of low thermal expansion polyimide and inorganic materials has been proposed as one future technology for submicron VLSIs. Consequently, adhesiveless, high quality flexible printed circuit boards have been developed using a polyimide with the same TEC as copper foil. Their most significant property is a high dimensional stability after heat treatments, such as in a soldering process. Furthermore, they have very high adhesion strength at elevated temperatures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 113
Copyright
Copyright © Materials Research Society 1988

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References

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