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Properties of a Photoimageable Thin Polyimide Film

Published online by Cambridge University Press:  25 February 2011

Taishih Maw  and
Richard E. Hopla
Taishih Maw
Affiliation:
Ciba-Geigy Corporation, Ardsley, NY 10502
Richard E. Hopla
Affiliation:
Ciba-Geigy Corporation, Ardsley, NY 10502
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Abstract

Mechanical properties (tensile modulus, tensile strength, elongation at break), thermal properties (T8' CTE, thermo-decomposition temperature, and rate of weight loss) and electrical properties of Problmlde 414 cured films have been determined. The mechanical properties of Probimide 414 thin films are highly dependent on the hard-bake temperature, hard-bake time, and purge gas, but not dependent on the level of the exposure energy or the presence of 1% Irganox 1010 (w/w) as a stabilizer. At a hard-bake temperature of 350ºC and a nitrogen purge rate of 15 SCFH, Probimide 414 films showed excellent retention of the mechanical properties during extended heat treatment.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 71
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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