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The Thermal Annealing Effect On The Residual Stress And Interface Adhesion In The Compressive Stressed DLC Film.

Published online by Cambridge University Press:  01 February 2011

Heon Woong Choi ,
Myoung-Woon Moon ,
Tae-Young Kim ,
Kwang-Ryeol Lee  and
Kyu Hwan Oh
Heon Woong Choi
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–742, Korea
Myoung-Woon Moon
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–742, Korea
Tae-Young Kim
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–742, Korea Thin Film Technology Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongryang, Seoul 136–791, Korea
Kwang-Ryeol Lee
Affiliation:
Thin Film Technology Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongryang, Seoul 136–791, Korea
Kyu Hwan Oh
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–742, Korea
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Abstract

We studied on the thermal annealing effect on the residual stress and the mechanical properties in thin compressive stressed diamond-like carbon film on Si substrate. Annealing experiments were carried out with Rapid Thermal Procedure system at 200–600 °C, and the stress change with annealing temperature was investigated by in-situ stress measurement system. The apparent stress reduction occurred with minimal structure changes. In order to measure the change of chemical structure of diamond-like carbon film by annealing, we used Raman spectrometer. The adhesion deterioration in interface has been detected as annealing temperature increased. In the compressive stressed DLC film, we observed the dramatic evolution of interface delamination at certain high temperature using in-situ heating stage built in Environment SEM. The quantitative change of adhesion affected by annealing process was also measured with scratch testing. For exploring the interface structure affected by the thermal annealing process at high temperature, the cross section of annealed film has been observed with HR TEM.

Keywords

Thermal annealingAdhesionResidual stress
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U11.42
Copyright
Copyright © Materials Research Society 2004

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References

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