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Engineered Solder-Directed Self-Assembly Across Length Scales

Published online by Cambridge University Press:  01 February 2011

Robert Knuesel ,
Shameek Bose ,
Wei Zheng  and
Heiko O Jacobs
Robert Knuesel
Affiliation:
knue0010@umn.edu, University of Minnesota, Department of Electrical and Computer Engineering, 200 Union Street SE, Minneapolis MN 55455, United States
Shameek Bose
Affiliation:
hjacobs@umn.edu, University of Minnesota, Electrical and Computer Engineering, 200 Union St. SE, Minneapolis, MN, 55455, United States
Wei Zheng
Affiliation:
shameek@umn.edu, University of Minnesota, Department of Electrical and Computer Engineering, 200 Union Street SE, Minneapolis, MN, 55455, United States
Heiko O Jacobs
Affiliation:
zhen0044@umn.edu, University of Minnesota, Department of Electrical and Computer Engineering, 200 Union Street SE, Minneapolis, MN, 55455, United States
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Abstract

We report on recent progress in the directed self-assembly of discrete inorganic semiconductor device components. Different from prior research, the goal is to enable the integration of increasingly small dies while supporting unique-angle orientation and contact pad registration. The process is based on the reduction of surface free energy between liquid solder coated areas on the substrate and metal-coated binding sites on the semiconductor dies. Recent advances include flip-chip assembly with unique angular orientation accomplished using “two-element” docking sites that contain pedestals that act as chaperones for the solder directed assembly to take place. The scale reduction to 20 μm sized components involves the use of a liquid-liquid interface to concentrate component delivery and speed up the self-assembly process to prevent oxidative dissolution of the solder sites prior to completion.

Keywords

self-assemblypackagingmicrostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B05-03
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

[1] Cohn, M. B., Bohringer, K. F., Noworolski, J. M., Singh, A., Keller, C. G., Goldberg, K. Y., Howe, R. T., Proceedings of SPIE 1998, 3512, 2.Google Scholar
[2] Clark, T. D., Tien, J., Duffy, D. C., Paul, K. E., Whitesides, G. M., Journal of the American Chemical Society 2001, 123, 7677.Google Scholar
[3] Fearing, R. S., Proceedings 1995, 212.Google Scholar
[4] Zhang, S., Nature Biotechnology 2003, 21, 1171.Google Scholar
[5] Whitesides, G. M., Grzybowski, B., Science 2002, 295, 2418.Google Scholar
[6] Yeh, H. J. J., Smith, J. S., IEEE Photonics Technology Letters 1994, 6, 706.Google Scholar
[7] Smith, J. S., Yeh, H. J. J., US Patent 1998, 5,824,186.Google Scholar
[8] Gracias, D. H., Tien, J., Breen, T. L., Hsu, C., Whitesides, E. M., Science 2000, 289, 1170.Google Scholar
[9] Boncheva, M., Gracias, D. H., Jacobs, H. O., Whitesides, G. M., Proc. Natl. Acad. Sci. USA 2002, 99, 4937.Google Scholar
[10] Jacobs, H. O., Tao, A. R., Schwartz, A., Gracias, D. H., Whitesides, G. M., Science 2002, 296, 323.Google Scholar
[11] Srinivasan, U., Liepmann, D., Howe, R. T., Journal of Microelectromechanical Systems 2001, 10, 17.Google Scholar
[12] Srinivasan, U., Helmbrecht, M. A., Rembe, C., Muller, R. S., Howe, R. T., IEEE Journal of Selected Topics in Quantum Electronics 2002, 8, 4.Google Scholar
[13] Böhringer, K. F., Srinivasan, U., Howe, R. T., Interlaken, Switzerland, 2001.Google Scholar
[14] Zheng, W., Buhlmann, P., Jacobs, H. O., Proc. Natl. Acad. Sci. USA 2004, 101, 12814.Google Scholar
[15] Zheng, W., Jacobs, H. O., Applied Physics Letters 2004, 85, 3635.Google Scholar
[16] Zheng, W., Jacobs, H. O., Advanced Functional Materials 2005, 15, 732.Google Scholar
[17] Patolsky, F., Zheng, G., Lieber, C. M., Analytical Chemistry 2006, 78, 4260.Google Scholar
[18] Jacobs, H. O., Wei, Z., USA, Provisional Application, March 2006.Google Scholar
[19] Barry, C. R., Jacobs, H. O., Nano Letters 2006, 6, 2790.Google Scholar
[20] Xiong, X., Hanein, Y., Fang, J., Wang, Y., Wang, W., Schwartz, D. T., Bohringer, K. F., Journal of Microelectromechanical Systems 2003, 12, 117.Google Scholar
[21] Stauth, S. A., Parviz, B. A., Proceedings of the National Academy of Sciences of the United States of America 2006, 103, 13922.Google Scholar