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Low Temperature Direct Metal Bonding by Self Assembled Monolayers

Published online by Cambridge University Press:  01 February 2011

Xiaofang Ang ,
Li Cheong Chin ,
Guo Ge Zhang ,
Jun Wei ,
Zhong Chen  and
Chee Cheong Wong
Xiaofang Ang
Affiliation:
angx0004@ntu.edu.sg, School of Materials Science & Engineering,Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North Block N4.1, Level B3,Rm N4.1-B3-02, Singapore, 639798, Singapore, +65-67906161, +65-67909081
Li Cheong Chin
Affiliation:
xiaojun_chin@hotmail.com, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
Guo Ge Zhang
Affiliation:
Guoge.Zhang@Honeywell.com, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
Jun Wei
Affiliation:
jwei@SIMTech.a-star.edu.sg, Singapore Institute of Manufacturing Technology, Micro-Joining and Substrate Technology, Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Singapore
Zhong Chen
Affiliation:
ASZChen@ntu.edu.sg, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
Chee Cheong Wong
Affiliation:
WongCC@ntu.edu.sg, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
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Abstract

Elevated bonding temperature for interconnection deteriorates the reliability of both the device and the interconnect; hence the imperative for developing low temperature bonding methods. This study investigates the feasibility of using self-assembled monolayers (SAMs) to assist direct gold-gold bonding. This involves a simple molecular self-assembly process whereby a monolayer of alkyl chains with a sulfur end group is attached to the gold surface prior to thermocompression bonding. Using this method, we have achieved gold to gold bonding at a bonding temperature below 100°C, a significant reduction compared to the conventional bonding temperatures of above 150 °C. We attribute this temperature reduction to two properties of SAMs - (1) surface passivation of the Au surface that precludes adsorption of surface contaminants, and (2) The easy displacement of SAMs through thermal desorption just before bonding occurs. This SAMs-assisted bonding mechanism is supported by X-ray photoelectron spectroscopy (XPS) and surface plasmon resonance (SPR) results.

Keywords

self-assemblybondingpassivation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B10-03
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1 Jellison, J.L., IEEE Transactions On Parts, Hybrids, And Packaging 11 (3), 206–212 (1975).Google Scholar
2 Ang, X.F., Zhang, G.G., et al., Thin Solid Films 504 (1-2), 379–383 (2006)Google Scholar
3 Banda, P., Meng, Ho Hong, Whelan, C. et al., presented at the Electronics Packaging Technology Conference, 4th., 344–349, (2002) (unpublished).Google Scholar
4 Laibinis, P.E., Whitesides, G.M., J. Am. Chem. Soc. 114, 9022–9028 (1992).Google Scholar
5 Hutt, D.A., Liu, C., Appl. Surf. Sci. 252, 400–411 (2005).Google Scholar
6 Azzaroni, O., Cipollone, M., Vela, M.E., Salvarezza, R.C., Langmuir 17,1483–1487 (2001).Google Scholar
7 Laibinis, P.E., Whitesides, G.M., Allara, D.L., Tao, Y.T., Parikh, A.N., Nuzzo, R.G.,J. Am.Chem. Soc. 113, 7152–7167 (1991).Google Scholar
8 Ang, X.F., Li, F.Y., Wei, J. and et.al, presented at Technological Advances of Thin Films & Surface Coatings Conference, 3rd., submitted for special issue of Thin Solid Films (2006)Google Scholar
9 Ang, X.F., Wei, J., Chen, Z. and et al., (2007) (unpublished).Google Scholar
10 Willey, T. M., Vance, A. L. et.al., Surface Science, 576, 188–196 (2005)Google Scholar
11 Laiho, T., Leiro, J. A., and Lukkari, J., Applied Surface Science 212–213, 525–529 (2003).Google Scholar
12 Jellison, J., Parts, Hybrids, and Packaging, IEEE Transactions on, 13 (2), 132–137 (1977).Google Scholar
13 Ekgasit, S., Thammacharoen, C., Knoll, W., Anal. Chem, 76, 561–568 (2004).Google Scholar
14 Guo, Q., Sun, X., Palmer, R. E., Phys. Rev. B., 71, 035406 (2005).Google Scholar
15 Ishida, T., Nishida, N., Tsuneda, S., Hara, M., Sasabe, H., Knoll, W., Jpn. J. Appl. Phys, 35, L1710–L1713 (1996).Google Scholar
16 Ishida, T., Hara, M., Kojima, I., Tsuneda, S., Nishida, N., Sasabe, H., Knoll, W., Langmuir, 14, 2092–2096 (1998).Google Scholar