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Adhesion Strength and Microstructure of Cu/Ni/OsOx/glass Structure for Highly-Reliable Cu Interconnection
Published online by Cambridge University Press: 03 July 2013
Abstract
This study demonstrates that thin metallic oxide layers, such as OsOx and ZnO, function as a strong adhesion layer between Cu film and glass substrate. The adhesion strength was studied with a micro-scratch tester and the films and interfaces were characterized by energydispersive X-ray spectrometry. The presence of an extremely thin intermixing layer was confirmed at the metal/glass interfaces. The formation of such an interfacial layer increased the adhesion strength significantly.
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- Copyright © Materials Research Society 2013
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