Hostname: page-component-8448b6f56d-tj2md Total loading time: 0 Render date: 2024-04-24T03:27:49.199Z Has data issue: false hasContentIssue false
  • English
  • Français

Micro-fluidic applications of telephone cord delamination blisters

Published online by Cambridge University Press:  01 February 2011

Alex A. Volinsky ,
Patrick Waters  and
Gregory Wright
Alex A. Volinsky
Affiliation:
University of South Florida, Dept. of Mechanical Engineering, Tampa FL 33620 USA, Volinsky@eng.usf.edu; http://www.eng.usf.edu/~volinsky
Patrick Waters
Affiliation:
University of South Florida, Dept. of Mechanical Engineering, Tampa FL 33620 USA, Volinsky@eng.usf.edu; http://www.eng.usf.edu/~volinsky
Gregory Wright
Affiliation:
University of South Florida, Dept. of Mechanical Engineering, Tampa FL 33620 USA, Volinsky@eng.usf.edu; http://www.eng.usf.edu/~volinsky
Get access

Abstract

Argon pressure significantly affects the residual stress in sputter deposited thin films and coatings. In case of W thin films, high residual stresses on the order of 1–2 GPa are quite common. With the rest of sputtering parameters being equal, argon pressure determines the sign and the value of residual stress.

When the amount of stored elastic energy in the film due to the residual stress exceeds the interfacial toughness, fracture normally occurs. Telephone cord buckling delamination blisters are commonly observed in compressed thin films. These mechanically active features form by a loss of adhesion between the film and the substrate due to residual stress relief, and exhibit directional growth under certain conditions. This paper considers telephone cord delamination channels for micro-fluidics applications, as this could to be a valuable, reliable, and inexpensive method of forming open channels.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 855: Symposium W – Mechanically Active Materials , 2004 , W3.16
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Nguyen, N., Wereley, S., Microfluidics, 1–19, 285–286, (2002).Google Scholar
2. Spence, A., Retterer, S., Isaacson, M., Microfabricated Model Silicon Probes with Microfluidic, Channels for Drug Delivery, NNUN Abstracts 2002/Biology & Chemistry, p. 13, (2002).Google Scholar
3. Li, Y., Gulari, M.N., Wise, K.D., Proceedings of mTAS 2003 Seventh International Conference on Micro Total Analysis Systems, October 5–9, Squaw Valley, CA USA, Vol. 2, Editors: Northrup, M.A., Jensen, K.F., Harrison, D.J., pp. 931–934, (2003).Google Scholar
4. Volinsky, A.A., Mat. Res. Soc. Symp. Proc. Vol. 749, W10.7, (2003).Google Scholar
5. Volinsky, A.A., Meyer, D.C., Leisegang, T., Paufler, P., Mat. Res. Soc. Symp. Proc. Vol. 795, U3.8, (2003).Google Scholar
6. World Wide Web: http://www.eng.usf.edu/~volinsky Google Scholar
7. Volinsky, A.A., Waters, P., Kiely, J.D., Johns, E.C., Mat. Res. Soc. Symp. Proc. Vol. 854E, U9.5, (2005).Google Scholar
8. Burrola, V.P., Solar Energy Materials, Vol. 3/1–2, pp. 117–126, (1980)Google Scholar
9. Volinsky, A.A., Moody, N.R., Gerberich, W.W., Acta Mater., Vol. 50/3, pp.441–466, (2002).Google Scholar
10. Moon, M.W., Lee, K.R., Oh, K.H., Hutchinson, J.W., Acta Mater., Vol. 52/10, pp. 3151–3159, (2004).Google Scholar
11. Volinsky, A.A., Moody, N.R., Gerberich, W.W., International Journal of Fracture, Vol. 119, No. 4, pp. 431–439, 2003 Google Scholar
12. Volinsky, A.A., Moody, N.R., Kottke, M.L., Gerberich, W.W., Phil. Mag. A, Vol. 82, No. 17/18, pp. 3383–3391, 2002 Google Scholar
13. Hutchinson, J.W., Suo, Z., Adv. In Appl. Mech., Vol. 29, pp. 63–191 (1992).Google Scholar
14. Volinsky, A.A., Moody, N.R., Gerberich, W.W., Acta Mater. Vol. 50/3, pp. 441–466, (2002).Google Scholar