Hostname: page-component-8448b6f56d-wq2xx Total loading time: 0 Render date: 2024-04-19T16:31:14.486Z Has data issue: false hasContentIssue false
  • English
  • Français

Latent Patterned Surface Metallization of Silver Ion-Doped Polyimide Films

Published online by Cambridge University Press:  31 January 2011

Luke M. Davis ,
Tyler S. Stukenbroeker ,
Christopher J. Abelt ,
Joseph L. Scott ,
Evguenia Orlova  and
David Wallace Thompson
Luke M. Davis
Affiliation:
davis71@illinois.edu, College of William and Mary, Chemistry, Williamsburg, Virginia, United States
Tyler S. Stukenbroeker
Affiliation:
tsstuk@wm.edu, College of William and Mary, Chemistry, Williamsburg, Virginia, United States
Christopher J. Abelt
Affiliation:
cjabelt@wm.edu, College of William and Mary, Chemistry, Williamsburg, Virginia, United States
Joseph L. Scott
Affiliation:
jlscott@wm.edu, College of William and Mary, Biology, Williamsburg, Virginia, United States
Evguenia Orlova
Affiliation:
exorlo@wm.edu, College of William and Mary, Biology, Williamsburg, Virginia, United States
David Wallace Thompson
Affiliation:
dwthom@wm.edu, College of William and Mary, Chemistry, 540 Landrum Drive, Williamsburg, Virginia, 23187, United States, 757 221 2545
Get access

Abstract

A straightforward ambient temperature route to the fabrication of surface silver-metallized polyimide films is described. Silver(I) trifluoromethane sulfonate and a polyimide, derived from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and an equimolar amount of 4,4'-oxydianiline (ODA) and 3,5-diaminobenzoic acid (DABA), were dissolved together in dimethylacetamide. Silver(I)-doped films were prepared at thicknesses of 25-50 microns and depleted of solvent by evaporation. The silver(I)-containing films were then treated with aqueous reducing agents, which brought forth silvered films exhibiting conductivity on the order of bulk polycrystalline silver and good specular reflectivity.

Keywords

compositemetalpolymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1192: Symposium PP – Materials and Devices for Flexible and Stretchable Electronics , 2009 , 1192-PP11-05
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Davis, L. M.; Thompson, D. S.; Dean, C. J.; Pevzner, M.; Scott, J. L.; Broadwater, S. T.; Thompson, D. W.; Southward, R. E. J. Appl. Polym. Sci. 2007, 103, 2409–2418.10.1002/app.25384Google Scholar
2 Davis, L. M. T., D. S.; Thompson, D. W.; Southward, R. E. Polyimides and Other High Temp. Polym. 2007, 4, 261–286.Google Scholar
3 Murdey, R.; Stuckless, J. T. J. Am. Chem. Soc. 2003, 125, 3995–3998.10.1021/ja028829wGoogle Scholar
4 Faupel, F.; Willecke, R.; Thran, A. Mater. Sci. Eng., R: Reports 1998, R22, 1–55.10.1016/S0927-796X(97)00020-XGoogle Scholar
5 Matienzo, L. J.; Unertl, W. N. In Polyimides: Fundamentals and Applications; Ghosh, M. K., Mittal, K. L., Eds.; Marcel Dekker: New York, 1996, pp 629–696.Google Scholar
6 Reich, S.; Mazur, S.; Avakian, P.; Wilson, F. C. J. Appl. Phys. 1987, 62, 287–292.10.1063/1.339142Google Scholar