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Kinetics of Cavity Growth In Solder Joints During Thermal Cycle

Published online by Cambridge University Press:  22 February 2011

Donald S. Stone ,
Thomas R. Homa  and
Che-Yu Li
Donald S. Stone
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
Thomas R. Homa
Affiliation:
IBM Corporation, Endicott, NY 13760
Che-Yu Li
Affiliation:
Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853
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Abstract

Grain boundary cavity growth in solder joints during thermal fatigue is analyzed. The stress cycle profile is estimated based on a geometrically simplified model of a ceramic chip carrier - printed circuit board assembly and a state variable equation for plastic flow in the solder.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 117
Copyright
Copyright © Materials Research Society 1985

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