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Development of Double-cantilever Infrared Focal Plane Arrays: Fabrication and Post-process Curvature Modification

Published online by Cambridge University Press:  01 February 2011

Shusen Huang ,
I-Kuan Lin ,
Hu Tao  and
Xin Zhang
Shusen Huang
Affiliation:
sshuang@bu.edu, Boston University, Manufacturing Engineering, 15 Saint Mary's St., Brookline, MA, 02446, United States
I-Kuan Lin
Affiliation:
ikuan@bu.edu, Boston University, Manufacturing Engineering, 15 Saint Mary's St., Brookline, MA, 02446, United States
Hu Tao
Affiliation:
hutao@bu.edu, Boston University, Manufacturing Engineering, 15 Saint Mary's St., Brookline, MA, 02446, United States
Xin Zhang
Affiliation:
xinz@bu.edu, Boston University, Manufacturing Engineering, 15 Saint Mary's St., Brookline, MA, 02446, United States
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Abstract

Uncooled double-cantilever microbolometers have the potential of reaching a noise-equivalent temperature difference (NETD) approaching the theoretical limit and thus have gained increasing interest. Each pixel of the device consists of two overlapping bimaterial cantilevers that deflect in opposite directions as their temperature rises due to the absorption of incident infrared radiation. This paper reports recent progress in the development of these double-cantilever focal plane arrays (FPAs), including fabrication and post-process curvature modification.

Keywords

devicesablationstress/strain relationship
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 952: Symposium F – Integrated Nanosensors , 2006 , 0952-F10-03
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Li, B., Sens. Actuators A 112, 351 (2004).Google Scholar
2. Zhao, Y., Choi, J., Horowitz, R., Majumdar, A., Kitching, J., and Norton, P., Proc. SPIE. 4820, 164 (2003).Google Scholar
3. Datskos, P.G., Lavrik, N.V., and Rajicm, S., Rev. Sci. Instrum. 75, 1134–1148 (2004).Google Scholar
4. Huang, S. and Zhang, X., Materials Research Soc., 890, 0890–Y08, (2005).Google Scholar
5. Huang, S. and Zhang, X., J. Micromech. Microeng. 16, 282, (2006).Google Scholar