Hostname: page-component-76fb5796d-2lccl Total loading time: 0 Render date: 2024-04-25T20:40:32.588Z Has data issue: false hasContentIssue false
  • English
  • Français

On the Microstructure of the Epoxy/Adherend Interphase

Published online by Cambridge University Press:  15 February 2011

M. Libera ,
W. Zukas ,
S. Wentworth  and
A. Patel
M. Libera
Affiliation:
Stevens Institute of Technology, Hoboken, NJ 07030
W. Zukas
Affiliation:
U.S. Army Materials Tech. Laboratory, Watertown, MA 02172
S. Wentworth
Affiliation:
U.S. Army Materials Tech. Laboratory, Watertown, MA 02172
A. Patel
Affiliation:
Stevens Institute of Technology, Hoboken, NJ 07030
Get access

Abstract

It is now recognized that there is a region at the epoxy/adherend interface known as the interphase whose chemistry and structure are different from those of bulk epoxy. There is, however, no adequate understanding of its microstructure. This paper describes differential scanning calorimetry (DSC) and transmission electron microscopy (TEM) studies of the interphase between an aromatic amine cured epoxy and alumina/oxidized-aluminum surfaces. DSC results show dramatic differences in resin-cure behavior in the presence of particulate alumina. TEM results on microtomed cross-sectional specimens of anodized aluminum wire embedded in epoxy show regions of incomplete epoxy infiltration and interfacial stress. RuO4 staining combined with high-angle annular-dark-field STEM imaging indicates that there are structural variations within the bulk epoxy at lengths of ∼10–30nm. The magnitude of these fluctuations decreases in the near the adherend interface, and there is a simultaneous variation in the average epoxy structure. A plausible interpretation of these observations is that the interphase region suffers a variation in curing-agent concentration of unknown magnitude and there is a higher concentration of homopolymerized epoxy there relative to the bulk.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 385: Symposium N – Polymer/Inorganic Interfaces II , 1995 , 65
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Sharpe, L. H., J. Adhesion 4, 51–64 (1972).Google Scholar
2. Sharpe, L.H., The Science and Technology of Adhesive Bonding, Proc. 35th Sagamore Army Materials Conf., ed. Sharpe, L. and Wentworth, S., Gordon and Breach, NY (1990).Google Scholar
3. Drzal, L.T., in Epoxy Resins and Composites HI, Springer-Verlag, Berlin (1986).Google Scholar
4. Miller, J. and Ishida, H., in Fundamentals of Adhesion, ed. Lee, L., Plenum, NY (1991).Google Scholar
5. Garton, A. et al., J. Poly. Sci. Tech. A 26, 1377 (1988).Google Scholar
6. Garton, A., J. Poly. Sci: Poly. Chem. Ed. 22, 1495 (1984).Google Scholar
7. Nigro, J. and Ishida, H., J. Appl. Poly. Sci. 38, 2191 (1989).Google Scholar
8. Ondrus, D., Boerio, F.J., and Grannen, K., in ref 2.Google Scholar
9. Tidrick, S.L. and Koenig, J.L., in ref 2.Google Scholar
10. Crompton, J.S., J. Materials Science 24, 1575–1581 (1989).Google Scholar
11. Dillingham, R. and Boerio, F.J., J. Adhesion 24, 315 (1987).Google Scholar
12. Zukas, W., Craven, K., and Wentworth, S., J. Adhesion 33, 89 (1990).Google Scholar
13. Zukas, W., Sennett, M., and Wentworth, S., Proc. 16th Ann. Mtg. Adhesion Soc. 187 (1993).Google Scholar
14. Pennycook, S.J., Ultramicroscopy 30, 58–69 (1989).Google Scholar
15. Filippo, G. Di, Sande, J. Vander, and Uhlmann, D., J. Appl. Poly. Sci. 35, 485–505 (1988).Google Scholar
16. Ricciardi, C.C. and Williams, R.J.J., J. Appl. Poly. Sci. 32, 3445 (1986).Google Scholar
17. Galy, J., Sabra, A., and Pascault, J., Poly. Engr. Sci. 26, 1514 (1986).Google Scholar
18. Grillet, A.C., Galy, J., Pascault, J., and Bardin, J., Polymer 30, 2094 (1989).Google Scholar
19. Barton, J.M., J. Macromolecular Sci. Chem. A 8, 25 (1974).Google Scholar
20. Libera, M., Ott, J., and Siangchaew, K., submitted to Ultramicroscopy.Google Scholar
21. Treat, J.S., Scheinbeim, J.I., and Couchman, P.R., Macromolecules 16, 589–598 (1983).Google Scholar