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Design considerations for the hot embossing of microstrip antennas on plastic foils

Published online by Cambridge University Press:  19 June 2009

Andreas Kilian ,
Michael Fuchs  and
Lorenz-Peter Schmidt
Andreas Kilian*
Affiliation:
Chair for Microwave Engineering and High-Frequency Technology, University of Erlangen-Nuremberg, Cauerstrasse 9, Erlangen 91058, Germany.
Michael Fuchs
Affiliation:
Chair of Polymer Technology, University of Erlangen-Nuremberg, Am Weichselgarten 9, Erlangen 91058, Germany.
Lorenz-Peter Schmidt
Affiliation:
Chair for Microwave Engineering and High-Frequency Technology, University of Erlangen-Nuremberg, Cauerstrasse 9, Erlangen 91058, Germany.
*
Corresponding author: A. Kilian E-mail: andreas.kilian@lhft.eei.uni-erlangen.de
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Abstract

In this contribution, fundamental design considerations for a novel metallization technique to realize millimeter-wave microstrip structures are presented. This hot embossing technology is a fast and economic process originating from the production of three-dimensional molded interconnect devices. Conductive structures are coated onto plastic parts or plastic foils using a heated stamp. This approach shows high potential and therefore will be investigated for the fabrication of low-cost printed antennas at millimeter-wave frequencies. The focus of this contribution is on design guidelines considering process parameters and interactions with substrate and copper foil characteristics derived from the fabrication and measurement of single microstrip patch antenna prototypes for radar applications in the industrial, scientific and medical (ISM) band at 24 GHz. Far-reaching potential lies in the utilization of the three-dimensional manufacturing technology for the construction of conformal integrated antenna systems based on the thermoforming capabilities of polymer substrates.

Keywords

Hot embossingMetallization techniqueMicrostrip patch antennaLow-cost fabricationMolded interconnect devices
Type
Original Article
Information
International Journal of Microwave and Wireless Technologies , Volume 1 , Special Issue 4: European Microwave Week 2008 , August 2009 , pp. 249 - 254
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2009

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References

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