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Microstructure evolution and quench sensitivity of Cu–10Ni–3Al–0.8Si alloy during isothermal treatment

Published online by Cambridge University Press:  05 February 2015

Leinuo Shen
Affiliation:
Department of Materials Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, China
Zhou Li*
Affiliation:
Department of Materials Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, China
Qiyi Dong
Affiliation:
State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China
Zhu Xiao
Affiliation:
Key Laboratory of Nonferrous Metal Materials Science and Engineering, Ministry of Education, Changsha 410083, China
Si Li
Affiliation:
Department of Materials Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, China
Qian Lei
Affiliation:
Department of Materials Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, China
*
a)Address all correspondence to this author. e-mail: lizhou6931@163.com
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Abstract

The variation of properties and evolution of microstructure of Cu–10Ni–3Al–0.8Si alloy during isothermal and aging treatment was studied. The time–temperature–property curves of the alloy were established. The nose temperature of the alloy was about 662 °C, and the alloy presented high quench sensitivity when quenched in the nose temperature zone. Discontinuous precipitation occurred when Cu–10Ni–3Al–0.8Si alloy was isothermally treated at 550 °C, and the discontinuous precipitates at the grain boundary became coarse when the isothermal temperature increased to 650 °C. Further increasing the isothermal temperature to 750 °C, cellular precipitation occurred in the alloy. Both Ni3Al precipitates with L12 ordered structure and δ-Ni2Si precipitates with DO22 ordered structure precipitated in the isothermally treated Cu–10Ni–3Al–0.8Si alloy. The orientation relationships between the precipitates and matrix were determined as ${[001]_{{\rm{Cu}}}}{\left\| {{{[001]}_{{\rm{N}}{{\rm{i}}_3}{\rm{Al}}}}\left\| {[001]} \right.} \right._\delta }$, ${(110)_{{\rm{Cu}}}}{\left\| {{{(110)}_{{\rm{N}}{{\rm{i}}_3}{\rm{Al}}}}\left\| {(010)} \right.} \right._\delta }$, and ${(1\bar 10)_{{\rm{Cu}}}}\left\| {{{(1\bar 10)}_{{\rm{N}}{{\rm{i}}_3}{\rm{Al}}}}} \right\|{(100)_\delta }$.

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Articles
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Xia, C-D., Jia, Y-L., Zhang, W., Dong, Q-Y., Xu, G-Y., and Wang, M-P.: Study of deformation and aging behaviors of a hot rolled-quenched Cu-Cr-Zr-Mg-Si alloy during thermomechanical treatments. Mater. Des. 39, 404 (2012).Google Scholar
Guo, F-A., Xiang, C-J., Yang, C-X., Cao, X-M., Mu, S-G., and Tang, Y-Q.: Study of rare earth elements on the physical and mechanical properties of a Cu-Fe-P-Cr alloy. Mater. Sci. Eng., B 147, 1 (2008).Google Scholar
Yagmur, L.: Effect of microstructure on internal friction and Young’s modulus of aged Cu-Be alloy. Mater. Sci. Eng., A 523, 65 (2009).Google Scholar
Xie, G-L., Wang, Q-S., Mi, X-J., Xiong, B-Q., and Peng, L-J.: The precipitation behavior and strengthening of a Cu-2.0 wt% Be alloy. Mater. Sci. Eng., A 558, 326 (2012).Google Scholar
Hu, T., Chen, J-H., Liu, J-Z., Liu, Z-R., and Wu, C-L.: The crystallographic and morphological evolution of the strengthening precipitates in Cu-Ni-Si alloys. Acta Mater. 61, 1210 (2012).Google Scholar
Pérez-Landazábal, J-I., Recarte, V., , M-L., and San, J-J.: Determination of the order in γ1 intermetallic phase in Cu-Al-Ni shape memory alloys. Intermetallics 11(9), 927 (2003).CrossRefGoogle Scholar
Donoso, E., Espinoza, R., Diànez, M-J., and Criado, J-M.: Microcalorimetric study of the annealing hardening mechanism of a Cu-2.8Ni-1.4Si (at%) alloy. Mater. Sci. Eng., A 56, 612 (2012).Google Scholar
Monzen, R. and Watanabe, C.: Microstructure and mechanical properties of Cu-Ni-Si alloys. Mater. Sci. Eng., A 483484, 117 (2010).Google Scholar
Suzuki, S., Shibutani, N., Mimura, K., Isshiki, M., and Waseda, Y.: Improvement in strength and electrical conductivity of Cu-Ni-Si alloys by aging and cold rolling. J. Alloys Compd. 417, 116 (2006).Google Scholar
Li, D., Franke, P., Fürtauer, S., Cupid, D., and Flandorfer, H.: The Cu-Sn phase diagram part II: New thermodynamic assessment. Intermetallics 34, 148 (2013).Google Scholar
Satoshi, S., Mikio, I., Shigeo, S., Kazuaki, W., and Takayuki, T.: Extraction of precipitates from age-hardenable Cu-Ti alloys. Mater. Charact. 82, 23 (2013).Google Scholar
Nestorović, S., Marković, I., and Marković, D.: Influence of thermomechanical treatment on the hardening mechanisms and structural changes of a cast Cu-6.6 wt.%Ag alloy. Mater. Des. 31, 1644 (2010).Google Scholar
Shiro, S. and Koji, N.: On quench sensitivity of Cu-Cr alloys. J. Jpn. Inst. Met. Mater. 33, 1155 (1969).Google Scholar
Zhang, X-M., Liu, W-J., Liu, S-D., and Zhou, M-Z.: Effect of processing parameters on quench sensitivity of an AA7050 sheet. Mater. Sci. Eng., A 528, 795 (2011).Google Scholar
Liu, S-D., Liu, W-J., Zhang, Y., Zhang, X-M., and Deng, Y-L.: Effect of microstructure on the quench sensitivity of AlZnMgCu alloys. J. Alloys Compd. 507, 53 (2010).Google Scholar
Hisashi, S. and Motohiro, K.: The T-T-T curve in Cu-Cr alloy. J. Jpn. Inst. Met. Mater. 35, 434 (1971).Google Scholar
Lei, Q., Li, Z., Zhu, A-Y., Qiu, W-T., and Liang, S-Q.: The transformation behavior of Cu-8.0Ni-1.8Si-0.6Sn-0.15Mg alloy during isothermal heat treatment. Mater. Charact. 62, 904 (2011).Google Scholar
Shen, L-N., Li, Z., Zhang, Z-M., Dong, Q-Y., Xiao, Z., Lei, Q., and Qiu, W-T.: Effects of silicon and thermo-mechanical process on microstructure and properties of Cu-10Ni-3Al-0.8Si alloy. Mater. Des. 62, 265 (2014).Google Scholar
Blatt, F-J.: Effect of point imperfections on the electrical properties of copper. I. Conductivity. Phys. Rev. 99(6), 1708 (1955).Google Scholar
Lei, Q., Li, Z., Xiao, T., Pang, Y., Xiang, Z-Q., Qiu, W-T., and Xiao, Z.: A new ultrahigh strength Cu-Ni-Si alloy. Intermetallics 42, 77 (2013).Google Scholar
Alexander, W-O.: Copper-rich nickel-aluminium-copper alloys. Part II—The constitution of the copper-nickel-rich alloys. J. Inst. Met. 30, 425 (1938).Google Scholar
Cho, Y-R., Kim, Y-H., and Lee, T-D.: Precipitation hardening and recrystallization in Cu-4% to 7% Ni-3% Al alloys. J. Mater. Sci. 26, 2879 (1991).Google Scholar
Robinson, J-S., Cudd, R-L., Tanner, D-A., and Dolan, G-P.: Quench sensitivity and tensile property inhomogeneity in 7010 forgings. J. Mater. Process. Technol. 119, 261 (2001).Google Scholar
Torma, T., Kovács, E-C., Turmezey, T., Ungár, T., and Kovács, I.: Hardening mechanisms in Al-Sc alloys. J. Mater. Sci. 24, 3924 (1989).Google Scholar