Hostname: page-component-76fb5796d-5g6vh Total loading time: 0 Render date: 2024-04-25T14:28:13.575Z Has data issue: false hasContentIssue false

Polycrystalline Si Films Fabricated by Low Temperature Selective Nucleation and Solid Phase Epitaxy Process

Published online by Cambridge University Press:  10 February 2011

Claudine M. Chen
Affiliation:
Thomas J. Watson Laboratories of Applied Physics, California Institute of Technology, Pasadena, CA 91125
Harry A. Atwater
Affiliation:
Thomas J. Watson Laboratories of Applied Physics, California Institute of Technology, Pasadena, CA 91125
Get access

Abstract

With a selective nucleation and solid phase epitaxy (SNSPE) process, grain sizes of 10 μm have been achieved to date at 620°C in 100 nrm thick silicon films on amorphous SiO2, with potential for greater grain sizes. Selective nucleation occurs via a thin film reaction between a patterned array of 20 rnm thick indium islands which act as heterogeneous nucleation sites on the amorphous silicon starting material. Crystal growth proceeds by lateral solid phase epitaxy from the nucleation sites, during the incubation time for random nucleation. The largest achievable grain size by SNSPE is thus approximately the product of the incubation time and the solid phase epitaxy rate. Electronic dopants, such as B, P, and Al, are found to enhance the solid phase epitaxy rate and affect the nucleation rate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Brendel, R., Bergmann, R. B., Lolgen, P., Wolf, M., and Werner, J. H., Appl. Phys. Lett. 70 (3) 390 (1997).Google Scholar
[2] Sproul, A. B., Shi, Z., Zhao, J., Wang, A., Tang, Y. H., Yun, F., Young, T., Huant, Y., Edmiston, S., Wenham, S. R., and Green, M. A., Characterization and Analysis of Multilayer Solar Cells, (Conference Record, 24th IEEE Photovoltaic Specialists Conference, December, 1994).Google Scholar
[3] Matsuyama, T., Terada, N., Baba, T., Sawada, T., Tsuge, S., Wakisaka, K., and Tsuda, S., J. Noncryst. Solids 200, 940 (1996).Google Scholar
[4] Yang, C. M. and Atwater, H. A., Appl. Phys. Lett 68 (24) 3392 (1996).Google Scholar
[5] Radnoczi, G., Robertsson, A., Hentzell, H. T. G., Gong, S. F., and Hasan, M. A., J. Appl. Phys. 69 (9) 6394 (1991).Google Scholar
[6] Iverson, R. B. and Reif, R., J. Appl. Phys. 62 (5) 1675 (1987).Google Scholar
[7] Olson, G. L. and Roth, J. A., Material Science Reports 3, (1988).Google Scholar
[8] Ghandhi, Sorab K., VLSI Fabrication Principles, (Wiley, New York, 1983), p. 134.Google Scholar