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Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification

Published online by Cambridge University Press:  26 January 2016

Shivani Joshi*
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
Antonie van Loon
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands
Angel Savov
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
Ronald Dekker
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
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Abstract

Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.

Type
Articles
Copyright
Copyright © Materials Research Society 2016 

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References

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