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Analysis of Electromigration- and Stress-Induced Dynamical Response of Voids Confined in Metallic Thin Films

Published online by Cambridge University Press:  26 February 2011

M. Rauf Gungor ,
Jaeseol Cho  and
Dimitrios Maroudas
M. Rauf Gungor
Affiliation:
gungor@ecs.umass.edu, University of Massachusetts, Amherst, Department of Chemical Engineering, 686 N Pleasant Street, Amherst, MA, 01003, United States
Jaeseol Cho
Affiliation:
jacho@ecs.umass.edu, University of Massachusetts, Amherst, Department of Chemical Engineering, United States
Dimitrios Maroudas
Affiliation:
maroudas@ecs.umass.edu, University of Massachusetts, Amherst, Department of Chemical Engineering, United States
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Abstract

A theoretical analysis based on self-consistent dynamical simulations is presented of electromigration- and stress-induced surface morphological response of voids confined in metallic thin films. The analysis predicts the onset of stable time-periodic states for the void surface morphological response, which is associated with current-driven wave propagation on the void surface. This time-periodic response is demonstrated under certain electromigration conditions and detailed response diagrams are presented which map the corresponding parameter space to regions of steady, time-periodic, and unstable surface morphological response. The evolution of the electrical resistance of these thin films also is computed, providing an interpretation for experimentally observed time-periodic response of the electrical resistance of metallic interconnect lines on the basis of current-driven void morphological evolution. In addition, we demonstrate significant effects on the electromigration-induced morphologically stable void migration of mechanical stress application in a metallic thin film. Specifically, we find that under certain electromechanical conditions, elastic stress can cause substantial retardation of void motion, as measured by the constant speed of electromigration-induced translation of morphologically stable voids. More importantly, this effect suggests the possibility for complete inhibition of void motion under stress.

Keywords

electromigrationdiffusionsimulation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 899: Symposium N – Dynamics in Small Confining Systems VIII , 2005 , 0899-N07-17
Copyright
Copyright © Materials Research Society 2006

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References

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