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Polishing Slurries with Aluminate-modified Colloidal Silica Abrasive

Published online by Cambridge University Press:  01 February 2011

Irina Belov ,
Joo-Yun Kim ,
Paula Watkins ,
Martin Perry  and
Keith Pierce
Irina Belov
Affiliation:
Praxair Electronics, Indianapolis, Indiana
Joo-Yun Kim
Affiliation:
Praxair Electronics, Indianapolis, Indiana
Paula Watkins
Affiliation:
Praxair Electronics, Indianapolis, Indiana
Martin Perry
Affiliation:
Praxair Electronics, Indianapolis, Indiana
Keith Pierce
Affiliation:
Praxair Electronics, Indianapolis, Indiana
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Abstract

This study has developed a route for increasing stability of colloidal silica particles in acidic polishing slurries. Drastic improvement in colloid stability has been achieved by using SiO2 particles with increased negative surface charge through doping/modification with metallate ions Me(OH)4–, particularly with aluminate ions. Novel Copper CMP slurries employing aluminate-doped colloidal silica provide high removal rates, good planarization and dishing performance, demonstrate required stability and long shelf life while preserving all the morphological advantages of colloidal abrasive particles. The developed route is also useful for production of acidic polishing slurries for other applications, such as Tungsten and STI CMP, as well as in polishing hard drive disks, fiber optic connectors, etc.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W6.9
Copyright
Copyright © Materials Research Society 2005

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