Hostname: page-component-8448b6f56d-gtxcr Total loading time: 0 Render date: 2024-04-23T22:14:29.949Z Has data issue: false hasContentIssue false
  • English
  • Français

Pad Topography, Contact Area and Hydrodynamic Lubrication in Chemical-Mechanical Polishing

Published online by Cambridge University Press:  31 January 2011

Leonard John Borucki ,
Ting Sun ,
Yun Zhuang ,
David Slutz  and
Ara Philipossian
Leonard John Borucki
Affiliation:
len.borucki@gmail.comlenborucki@aol.com, Araca Incorporated, Tucson, Arizona, United States
Ting Sun
Affiliation:
tsun@email.arizona.edu, University of Arizona, Dept of Chemical and Environmental Engineering, Tucson, Arizona, United States
Yun Zhuang
Affiliation:
yunzhuang@aracainc.com, Araca Incorporated, Tucson, Arizona, United States
David Slutz
Affiliation:
dave.slutz@morganplc.com, Morgan Advanced Ceramics, Allentown, Pennsylvania, United States
Ara Philipossian
Affiliation:
aphilipossian@aracainc.com, Araca Incorporated, Tucson, Arizona, United States
Get access

Abstract

Material removal during CMP occurs by the activation of slurry particles at contact points between pad summits and the wafer. When slurry is present and the wafer is sliding, contacts become lubricated. We present an analysis valid over the full range from static contact to hydroplaning that indicates that CMP usually operates in boundary or mixed lubrication mode at contacts and that the lubrication layer is nanometers thick. The results suggest that the sliding solid contact area is mainly responsible for the friction coefficient while both the solid contact and lubricated areas control the removal rate.

Keywords

tribologyCMPfluid
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1157: Symposium E – Science and Technology of Chemical Mechanical Planarization (CMP) , 2009 , 1157-E01-02
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Borucki, L., Zhuang, Y. and Philipossian, A., Proc. 2005 PacRim Conference, pp. 411–416.Google Scholar
2 and, B.J. Hamrock Dowson, D., Trans. ASME J. Lubrication Tech., 100, 236–245 (1978).Google Scholar
3 Landau, L.D D. and Lifshitz, E.M., Theory of Elasticity (33rd Ed.), Butterworth, Butterworth-Heinemann, Ch. 1.Google Scholar
4 Szeri, A.Z., Fluid Film Lubrication Theory and Design Design, Cambridge. Press (1998) , Ch. 2.Google Scholar
5 Kumar, A. and Booker, J. F., Trans. ASME J. of Tribology, Vol. 113, pp. 276–286 (1991).Google Scholar
6 Shi, F. and Salent, R.F., Trans. ASME J. of Tribology, Vol. 122, pp 308–316 (2000).Google Scholar
7 Guo, F. and Wong, P.L., Tribology International, 37 (2004), pp. 119–127.Google Scholar
8 Lortz, W., Menzel, F., Brandes, R., Klaessig, F., Knothe, T. and Shibasaki, T., Mat. Res. Soc. Sy Symp. Proc. Vol. 767, F 1.7 (2003).Google Scholar