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Comparative Study on Wafer-Level and Package-Level Electromigration Reliability for Sub-Quarter Micron Logic Devices

Published online by Cambridge University Press:  17 March 2011

Young B. Park  and
Duk W. Lee
Young B. Park
Affiliation:
System IC R & D Center, Hyundai Electronics Co., Ltd., Cheongju, 360-480, Korea
Duk W. Lee
Affiliation:
System IC R & D Center, Hyundai Electronics Co., Ltd., Cheongju, 360-480, Korea
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Abstract

The effects of Al underlayer between Ti and TiN on the electromigration (EM) lifetime of Al stack film were compared by the package-level and conventional wafer-level EM tests. The higher EM resistance of the Al stacks prepared with Ti underlayer can be best explained by their better Al (111) texture and grain size distribution than those with TiN underlayer. The surface roughness of the underlayer is related to the grain size distribution and surface roughness of Al film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 714: Symposium – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics II , 2001 , L9.3.1
Copyright
Copyright © Materials Research Society 2001

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References

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