The temperature distribution in InGaN-MQW light emitting diodes was examined during operation with spatially resolved micro-Raman and micro-Electroluminescence measurements. The experimental results were compared to finite element simulations. A good agreement between the different experimental and calculated data is found. Maximum operation temperatures up to 140 °C at a moderate forward currents of 30 mA are revealed by all three independent methods. Influences of substrate thickness, different substrates, and even bond-wires are shown.