We report on progress in the monolithic integration of a metal-semiconductor-metal (MSM) detector and transimpedence amplifier and of a photoconductive detector (PCD) with a metal-semiconductor field effect transistor (MESFET) in Hg1-xCdxTe. The layers of CdTe/n-type Hg1-xCdxTe were grown by MOCVD on semi-insulating GaAs substrates (2° misoriented 100). Fabrication of the devices was by an FET planar process; with a standard lift-off used to form Schottky metallization on both the interdigitated electrodes of the MSM detector (2μm width, 2μm spacing) and the gate of the MESFETs (5μm length, 100μm width). The MSM photodetectors exhibited breakdown voltages in the range 60 to 80V, a dark current of 1 Ona at 5V bias, and responsivities of > 1.0 A/W measured at 40V using CW 1.3um illumination. The integrated devices have been characterised by electrical and micro RBS techniques; the results were found to be strongly dependent on the stoichiometric x ratio of the Hg1-xCdxTe. This initial work demonstrates the suitability of Hg1-xCdxTe/GaAs structures in the fabrication of integrated optoelectronic circuits.