This study aimed to investigate the diverse clinical manifestations and simple early biomarkers predicting mortality of COVID-19 patients admitted to the emergency department (ED). A total of 710 patients with COVID-19 were enrolled from 6,896 patients presenting to the ED between January 2022 and March 2022. During the study period, a total of 478 patients tested positive for COVID-19, among whom 222 (46.4%) presented with extrapulmonary manifestations of COVID-19; 49 (10.3%) patients displayed gastrointestinal manifestations, followed by neurological (n = 41; 8.6%) and cardiac manifestations (n = 31; 6.5%). In total, 54 (11.3%) patients died. A Cox proportional hazards model revealed that old age, acute kidney injury at presentation, increased total leukocyte counts, low platelet counts, decreased albumin levels, and increased LDH levels were the independent predictors of mortality. The albumin levels exhibited the highest area under the curve in receiver operating characteristic analysis, with a value of 0.860 (95% confidence interval, 0.796–0.875). The study showed the diverse clinical presentations and simple-to-measure prognostic markers in COVID-19 patients presenting to the ED. Serum albumin levels can serve as a novel and simple early biomarker to identify COVID-19 patients at high risk of death.

The understanding of adhesion and survival behavior of bacterial pathogens on implant surfaces are critical to control and reduce implant-associated infections. Herein, the authors investigate the interactions of Staphylococcus aureus, one of the most prevalent causes of implant infections, with Mg–4Zn–0.5Ca implants. It was found that within 60 min of exposure, 99.1% of adherent bacteria were inactivated. The combination of unique mechanical properties, biodegradation kinetics, and antimicrobial characteristics of Mg–4Zn–0.5Ca alloy makes it a promising candidate for future implant applications.

The complete chloroplast (cp) genome sequences of three Amaranthus species (Amaranthus hypochondriacus, A. cruentus and A. caudatus) were determined by next-generation sequencing. The cp genome sequences of A. hypochondriacus, A. cruentus and A. caudatus were 150,523, 150,757 and 150,523 bp in length, respectively, each containing 84 genes with identical contents and orders. Expansion or contraction of the inverted repeat region was not observed among the three Amaranthus species. The coding regions were highly conserved with 99.3% homology in nucleotide and amino acid sequences. Five genes – matK, accD, ndhJ, ccsA and ndhF – showed relatively high non-synonymous/synonymous values (Ka/Ks > 0.1). Sequence comparison identified two insertion/deletion (InDels) greater than 40 bp in length, and polymerase chain reaction markers that could amplify these InDel regions were applied to diverse Korean Genbank accessions, which could discriminate the three Amaranthus species. Phylogenetic analyses based on 62 protein-coding genes showed that the core Caryophyllales were monophyletic and Amaranthoideae formed a sister group with the Betoideae and Chenopodioideae clade. Comparing each homologous locus among the three Amaranthus species, identified eight regions with high Pi values (>0.03). Seven of these loci, except for rps19-trnH (GUG), were considered to be useful molecular markers for further phylogenetic studies.

Highly sensitive electrolyte-insulator-semiconductor (EIS) sensors were realized by the integration of Si nanowires (NWs), which were fabricated by using a simple and economic electroless wet etching technique. EIS sensors with NWs longer than 1 μm were observed to have considerably increased capacitance and high pH sensitivity. The pH sensitivity of the EIS sensor with 3.8 μm long NWs was 60.2 mV/pH, which is higher than the theoretical Nernstian of 59 mV/pH. The EIS sensors with NWs exhibited slightly worse pH hysteresis and drift properties than that of the conventional planar type EIS sensor. The increases in pH sensitivity, hysteresis and drift are attributable to the extended surface area of the EIS sensors enabled by the NWs.

Background: A fall experienced by an elderly person is of special note because it appears to hold a reciprocal causal association with the fear of falling. This study attempts to determine the temporal relationship between the fear of falling and falling among community-dwelling elderly.

Methods: Data on falls experienced during the previous three years were obtained from 732 community-dwelling elderly people. Participants were also asked to provide detailed information about their most recent fall, including the date, time of day, place, circumstances, consequences of the fall, fear of falling, and activity limitations due to fear of falling.

Results: Those who had fallen within the past six months had over four times greater odds of a fear of falling and approximately five times greater odds of activity restriction, compared with those who had not fallen. The association decreased linearly over time, and became nonsignificant for those who had not fallen during the past 25–36 months.

Conclusions: The experience of a fall is strongly associated with an increased fear of falling, and the association appears to persist for at least two years. An elderly person who has experienced a fall requires continuous attention to prevent the development of fear as another problem, together with early intervention to counter the fear of falling.

System in package (SiP) is a superb candidate to enhance the area efficiency and performance of electronic packaging. Here, recent work on stacked chip type 3D SiP with vertically interconnected through hole vias are reported. The process includes; formation of 50um-diameter via holes, conformal deposition of SiO2 dielectric layer, deposition of Ta and Cu barrier layers, via filling by Cu electroplating, Cu/Sn bump formation for multi-chip stacking, and finally chip-to-PCB bonding using Sn-3.0Ag-0.5Cu solder and ENIG pad. A prototype 3D SiP stacked up to 10 layers was successfully fabricated.

A high frequency electrical model of the through hole via was proposed and the model parameters were extracted from measured S-parameters. The proposed model was verified by TDR/TDT (time domain reflectometry/time domain transmission) and eye-diagram measurement. Contact resistances of Cu via and bump joint were presented.