This paper reports on first results obtained on GaN epitaxial layer grown on a single wafer with a lateral variation in defect density. The chemically homogeneous GaN epitaxial layer was deposited by metalorganic chemical vapour deposition onto a specially prepared buffer layer. A chemical gradient in the nitrogen contents of the precursor flux was induced during the growth of the GaN buffer layer. This condition leads a corresponding gradient of the dislocation density within the epilayer. The electrical and optical properties of the GaN epilayer have been analysed by means of electron beam induced current, photoluminescence and photocurrent techniques. All our measurements reveal lateral gradients in the epilayer properties as concern (i) the density of recombining centres in the GaN film and (ii) their recombination activity, both radiative and nonradiative. This paper shows that a proper combination of beam based techniques can contribute to the detailed analysis of the well know yellow luminescence band which in the GaN epilayer here investigated consist of four well distinct peaks.

A detailed transmission electron microscopy study is performed on the pyramidal inversion domains that appear in highly Mg-doped GaN grown by metalorganics vapor phase epitaxy or by the high-pressure, high-temperature method. From a comparison between high resolution images of the inversion domain boundaries and simulations using different atomic models, we conclude that both basal and inclined domain boundaries are likely formed of a monomolecular layer of the definite compound Mg3N2. We show that, due to their high concentration, the formation of these defects may account for auto-compensation in Mg-doped GaN. We also show that the local band bending induced by the polarity inversion due to these defects can be at the origin of the blue luminescence of highly Mg-doped GaN, always observed when nanometric pyramidal inversion domains are also present.

GaN/sapphire layers have been grown by Metal Organic Vapour Phase Epitaxy (MOVPE). An amorphous silicon nitride layer is deposited using a SiH4/NH3 mixture prior to the growth of the low temperature GaN buffer layer. Such a process induces a 3D nucleation at the early beginning of the growth, resulting in a kind of maskless ELO process with random opening sizes. This produces a significant decrease of the threading dislocation (TD) density compared to the best GaN/sapphire templates. Ultra Low Dislocation density (ULD) GaN layers were obtained with TD density as low as 7×107cm−2 as measured by atomic force microscopy (AFM), cathodoluminescence and transmission electron microscopy (TEM). Time-resolved photoluminescence experiments show that the lifetime of the A free exciton is principally limited by capture onto residual donors, similar to the situation for nearly dislocation-free homoepitaxial layers.

Using micro-Raman scattering and finite element (FE) analysis, stress fields in epitaxial lateral overgrown (ELO) GaN fabricated by metalorganic vapor phase epitaxy (MOVPE) on sapphire substrates using a two-step growth method were investigated. Nearly full stress relaxation at the top ELO GaN surface can be achieved by increasing the thickness of ELO GaN to about 50 μm. Reductions in stress variation between window and overgrown regions can be achieved by using a double ELO GaN growth at a much smaller ELO thickness. Increased compressive stress at the coalescence boundary of two adjacent wings of ELO GaN was related to the presence of voids in this area. In the double ELO growth, stress near the top surface was mainly attributed to the presence of voids on top of the upper dielectric mask.

We have studied defects introduced in n-GaN during 25 keV hydrogen and 40 keV He implantation using deep level transient spectroscopy (DLTS). These measurements revealed that 25 keV hydrogen implantation introduces a complex set of electron traps, of which most are different to the defects observed after high-energy (MeV) electron and proton implantation. At least three of the defects detected after 25 keV proton implantation exhibit a metastable character in that they can be reproducibly removed and re-introduced during reverse and zero bias anneal cycles. Isochronal and isothermal annealing experiments yielded low activation energies of approximately 0.1 – 0.2 eV for both processes. By comparison, 40 keV He ion implantation introduced the same metastable defects, but in different relative concentrations.

In recent years, GaN and its alloys have been the subject of an intense global research effort to develop its optoelectronic properties in the blue-green region of the spectrum. Of particular interest has been the fact that despite a high density of threading dislocations, on the order of 108 to 1010 per cm2, thin film devices retain their ability to emit light. The origin of this behavior remains unclear, and it has even been suggested that reducing the number of defects by employing different growth techniques does not necessarily increase the crystal's lasing abilities. As research is now aiming to grow GaN on silicon (silicon has a large lattice-mismatch to GaN) in order to develop an inexpensive LED technology, dislocations are likely to remain a major issue. It is therefore essential that we develop a fundamental understanding of the electronic structure of these defects, in order to determine their effect on the properties.

We propose to model the spectral response of p-n junction photodetectors based on gallium nitride and related AlGaN alloys. The model is based on the resolution of the differential equations that govern the excess carrier variation in each layer of the photodiode taking into account all the physical parameters, in particular the presence of deep trap levels in the forbidden gap. We notice that the theoretical results are in good agreement with the experiments. We have also analysed the effect of the recombination velocity at the illuminated surface, as well as the impact of the thickness and the doping density of the p-type layer (illuminated zone) on the spectral response magnitude.

The misfit between GaN and 6H-SiC is 3.5 % instead of 16 % with sapphire, the epitaxial layers have similar densities of defects on both substrates. Moreover, the lattice mismatch between AlN and 6H-SiC is only 1%. Therefore, epitaxial layer overgrowth (ELO) of GaN on AlN/6H-SiC could be a route to further improve the quality of epitaxial layers. AlN has been grown by Halide Vapour Phase Epitaxy (HVPE) on (0001) 6H-SiC, thereafter a dielectric SiO2 mask was deposited and circular openings were made by standard photolithography and reactive ion etching. We have examined GaN layers at an early stage of coalescence in order to identify which dislocations bend and try to understand why. The analysed islands have always the same hexagonal shape, limited by facets. The a type dislocations are found to fold many times from basal to the prismatic plane, whereas when a+c dislocations bend to the basal plane, they were not seen to come back to a prismatic one.

Au/GaN and Cu/GaN Schottky contacts have been studied using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES). Clean and stoechiometric GaN samples were obtained using in situ hydrogen plasma treatment and Ga deposition. The growth of Cu and Au follows Stranski-Krastanov and Frank van der Merwe modes respectively. The interfaces are sharp and non-reactive. Schottky barriers of 1.15eV for Au/GaN and 0.85eV for Cu/GaN were measured using XPS.

Incorporation of Mg in metalorganic vapour phase epitaxy (MOVPE) GaN has been investigated, using two different Mg precursors: bis-methylcyclopentadienyl magnesium [(MeCp)2Mg] and Solution bis-cyclopentadienyl magnesium [Solution Cp2Mg]. SIMS analysis reveals an increased (two fold) efficiency of Mg incorporation for Solution Cp2Mg as compared to (MeCp)2Mg. These results are attributed to the stronger interaction of (MeCp)2Mg with NH3, leading to the formation of alkylmagnesium amine adducts, and a reduced effective Mg surface concentration. A decreased GaN growth rate with increasing Mg fluxes is also reported for both precursors. This effect is more pronounced for Solution Cp2Mg indicating that incorporation of Mg in the lattice proceeds via the capture of Mg into group III sites, and that the supply of Mg from the surface is reduced in the case when (MeCp)2Mg is used.

We report on the electrical properties of defects as determined by deep level transient spectroscopy (DLTS) introduced in epitaxially grown n-GaN by 2.0 MeV protons and 5.4 MeV He-ions. After He-ion bombardment three electron traps ER3 (Ec − 0.196 eV), ER4 (Ec − 0.78 eV), and ER5 (Ec − 0.95 eV) were introduced uniformly in the region profiled by DLTS with introduction rates of 3270 ± 200, 1510 ± 300, and 3030 ± 500 cm−1 respectively. Capture cross section measurements revealed that the electron capture kinetics of ER5 is similar to that of a line defect. A defect with similar electronic properties as ER3 is observed after 2.0 MeV proton irradiation. The emission rate of ER3 depends on the electric field strength in the space-charge region. This emission rate is modelled according to the Poole-Frenkel distortion of a square well with a radius of 20 ± 2 Å or alternatively, a Gaussian well with a characteristic width of 6.0 ± 1 Å. Hence, we conclude that ER1 is a point defect which appears to have an acceptor like character. Two additional electron traps, ER1 (Ec −0.13 eV) and ER2 (Ec − 0.16eV) with introduction rates of 30 ± 10 and 600 ± 100 cm−1 not thusfar observed after electron or He-ion bombardment were observed after proton irradiation.

The misfit between GaN and 6H-SiC is 3.5% instead of 16% with sapphire, the epitaxial layers have similar densities of defects on both substrates. Moreover, the lattice mismatch between AlN and 6H-SiC is only 1%. Therefore, epitaxial layer overgrowth (ELO) of GaN on AlN/6H-SiC could be a route to further improve the quality of epitaxial layers. AlN has been grown by Halide Vapour Phase Epitaxy (HVPE) on (0001) 6H-SiC, thereafter a dielectric SiO2 mask was deposited and circular openings were made by standard photolithography and reactive ion etching. We have examined GaN layers at an early stage of coalescence in order to identify which dislocations bend and try to understand why. The analysed islands have always the same hexagonal shape, limited by {0110} facets. The a type dislocations are found to fold many times from basal to the prismatic plane, whereas when a+c dislocations bend to the basal plane, they were not seen to come back to a prismatic one.

Au/GaN and Cu/GaN Schottky contacts have been studied using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES). Clean and stoechiometric GaN samples were obtained using in situ hydrogen plasma treatment and Ga deposition. The growth of Cu and Au follows Stranski-Krastanov and Frank van der Merwe modes respectively. The interfaces are sharp and non-reactive. Schottky barriers of 1.15eV for Au/GaN and 0.85eV for Cu/GaN were measured using XPS.

We have used current-voltage (I-V) measurements to assess and compare the electrical characteristics of resistively evaporated and sputter deposited Au Schottky contacts on epitaxially grown GaN. These I-V measurements revealed that resistively deposited Au contacts exhibited excellent rectification properties: high barrier height, low reverse current and good ideality factor (n = 1.04). In contrast, sputter deposited contacts had poor characteristics: low barrier height, high reverse current and non-linear forward I-V characteristics. The cause of this is thought to be defects introduced at and near the surface during sputter deposition. Deep level transient spectroscopy (DLTS) showed that at least four defects, with energy levels at 0.22±0.02 eV, 0.30±0.01 eV, 0.40±0.01 eV and 0.45±0.10 eV below the conduction band, were introduced in the GaN during sputter deposition. The first of these defects has similar electronic properties as a radiation induced defect in GaN, speculated to be the nitrogen vacancy, while the second appears to be the same as a defect in the as-grown material. The latter two defects have not previously been observed in as-grown or processed epitaxial GaN.

Wide gap nitride semiconductors have attracted significant attention recently due to their promising performance as short-wavelength light emitting diodes (LEDs) and blue lasers. One interesting issue concerning GaN is that the material is relatively insensitive to the presence of a density of dislocations which is six orders of magnitude higher than that for III-V arsenide and phosphide based LEDs. Although it is well known that these dislocations originate at the film-substrate interface during film growth, thread through the whole epilayer with line direction along <0001> and are perfect dislocations with Burgers vectors of a, c, or c+a, the reason why they have such a small effect on the properties of GaN is unclear.

To develop a fundamental understanding of the properties of these dislocations, the core structures are studied here by high resolution Z-contrast imaging in a 300kV VG HB603 scanning transmission electron microscope (STEM) with a resolution of 0.13nm.

We have used current-voltage (I-V) measurements to assess and compare the electrical characteristics of resistively evaporated and sputter deposited Au Schottky contacts on epitaxially grown GaN. These I-V measurements revealed that resistively deposited Au contacts exhibited excellent rectification properties: high barrier height, low reverse current and good ideality factor (n = 1.04). In contrast, sputter deposited contacts had poor characteristics: low barrier height, high reverse current and non-linear forward I-V characteristics. The cause of this is thought to be defects introduced at and near the surface during sputter deposition. Deep level transient spectroscopy (DLTS) showed that at least four defects, with energy levels at 0.22±0.02 eV, 0.30±0.01 eV, 0.40±0.01 eV and 0.45±0.10 eV below the conduction band, were introduced in the GaN during sputter deposition. The first of these defects has similar electronic properties as a radiation induced defect in GaN, speculated to be the nitrogen vacancy, while the second appears to be the same as a defect in the as-grown material. The latter two defects have not previously been observed in as-grown or processed epitaxial GaN.

Selective and lateral overgrowth by Metal Organics Vapour Phase Epitaxy (MOVPE) was carried out until coalescence to produce smooth and optically flat thick GaN layers. A GaN epitaxial layer is first grown using atmospheric pressure Metalorganic Vapour Phase Epitaxy on a {0001} Al2O3. substrate. Then a 30Å silicon nitride dielectric film is deposited in-situ by reaction of silane and ammonia to form a selective mask. Afterwards, the openings and the figures in the dielectric films are achieved using standard photolithographic technology. Stripes openings in the mask, revealing free GaN surface, are aligned in the 〈100〉 direction. Typical stripes spacing and width are 10 µm and 5 µm respectively. These patterned layers are further on used for epitaxial regrowth of GaN by MOVPE. The growth anisotropy and therefore the coalescence process is achieved by introducing (MeCp)2Mg in the vapour phase. A two-step process is reported which allows a dramatic reduction of threading dislocations density not only above the masked areas but also above the windows opened in the mask. With this process, very sharp bound exciton luminescence peaks are measured at low temperature in the overgrown GaN.

We report on the electrical properties of defects as determined by deep level transient spectroscopy (DLTS) introduced in epitaxially grown n-GaN by 2.0 MeV protons and 5.4 MeV He-ions. After He-ion bombardment three electron traps ER3 (Ec - 0.196 eV), ER4 (Ec - 0.78 eV), and ER5 (Ec - 0.95 eV) were introduced uniformly in the region profiled by DLTS with introduction rates of 3270 ± 200, 1510 ± 300, and 3030 ± 500 cm-1 respectively. Capture cross section measurements revealed that the electron capture kinetics of ER5 is similar to that of a line defect. A defect with similar electronic properties as ER3 is observed after 2.0 MeV proton irradiation. The emission rate of ER3 depends on the electric field strength in the space-charge region. This emission rate is modelled according to the Poole-Frenkel distortion of a square well with a radius of 20 ± 2 Å or alternatively, a Gaussian well with a characteristic width of 6.0 ± 1 Å. Hence, we conclude that ER1 is a point defect which appears to have an acceptor like character. Two additional electron traps, ER1 (Ec -0.13 eV) and ER2 (Ec - 0.16eV) with introduction rates of 30 ± 10 and 600 ± 100 cm-1 not thusfar observed after electron or He-ion bombardment were observed after proton irradiation.

Low frequency noise has been investigated in hexagonal n-type GaN with equilibrium electron concentration n ∼ 1017 cm−3 at T=300 K. The frequency and temperature dependencies of the spectral density of the current noise, SI, have been studied in the frequency range f from 20 Hz to 20 kHz. Over the whole temperature range from T=80K to 400K the SI(f) dependence is very close to 1/f. The value of the Hooge constant, α, is very large: α ∼ 5 – 7 and is found to be temperature independent. The effects of illumination on the low frequency noise in GaN are studied for the first time. The noise is unaffected by illumination with photon energy Eph < Eg, while band-to band illumination (Eph∼Eg ) influences the low frequency noise, increasing the noise at higher temperatures, and decreasing it at lower temperatures.

GaN/(0001)Sapphire grown by low pressure MOVPE is studied by high resolution Z-contrast imaging using STEM. First direct observation of the threading dislocation with edge character shows the atomic core structure, which appears to have a similar configuration to the {10–10} surface. The surfaces of the nanopipe walls are on {10–10} with the terminating layer between the atoms with one bond per pair. In addition, the high resolution Z-contrast image of the prismatic stacking fault confirms the results by conventional HRTEM.