The intensity attenuation of a high-power laser is a frequent task in the measurements of optical science. Laser intensity can be attenuated by inserting an optical element, such as a partial reflector, polarizer or absorption filter. These devices are, however, not always easily applicable, especially in the case of ultra-high-power lasers, because they can alter the characteristics of a laser beam or become easily damaged. In this study, we demonstrated that the intensity of a laser beam could be effectively attenuated using a random pinhole attenuator (RPA), a device with randomly distributed pinholes, without changing the beam properties. With this device, a multi-PW laser beam was successfully attenuated and the focused beam profile was measured without any alterations of its characteristics. In addition, it was confirmed that the temporal profile of a laser pulse, including the spectral phase, was preserved. Consequently, the RPA possesses significant potential for a wide range of applications.

Background: The influences of demographics, culture, language, and environmental changes on Mini-Mental State Examination (MMSE) scores are considerable.

Methods: Using a sample of 7452 healthy, community-dwelling elderly Koreans, aged 55 to 94 years, who participated in the four ongoing geriatric cohorts in Korea, we investigated demographic influences on MMSE scores and derived normative data for this population. Geropsychiatrists strictly excluded subjects with cognitive disorders according to the protocol of the Korean version of the Consortium to Establish a Registry for Alzheimer's Disease Assessment Packet (CERAD-K) Clinical Assessment Battery (CERAD-K-C).

Results: Education (standardized β = 0.463), age (standardized β = −0.303), and gender (standardized β = −0.057) had significant effects on MMSE scores (p < 0.001). The score of MMSE increase 0.379 point per 1-year education, decrease 0.188 per 1-year older, and decrease 0.491 in women compared to men. Education explained 30.4% of the scores’ total variance, which was much larger than the variances explained by age (8.4%) or gender (0.3%). Accordingly, we present normative data for the MMSE stratified by education (0, 1–3, 4–6, 7–9, 10–12, and ≥ 13 years), age (60–69, 70–79, and 80–89 years), and gender.

Conclusions: We provide contemporary education-, age-, and gender-stratified norms for the MMSE, derived from a large, community-dwelling elderly Korean population sample, which could be useful in evaluating individual MMSE scores.

We investigated the pressure dependence of the inductive coupled plasma (ICP) oxidation on the electrical characteristics of the thin oxide films. Activation energies and electron temperatures with different pressures were estimated. To demonstrate the pressure effect on the plasma oxide quality, simple N type metal-oxide-semiconductor (NMOS) transistors were fabricated and investigated in a few electrical properties. At higher pressure than 200mTorr, plasma oxide has a slightly higher on-current and a lower interfacial trap density. The on-current gain seems to be related to the field mobility increase and the lower defective interface to the electron temperature during oxidation.

To improve the IPD reliability of NAND flash memory, plasma oxidation was introduced as the post-treatment process of ONO (Oxide/Nitride/Oxide) IPD. The LP-CVD SiO2 modified by plasma oxidation showed the excellent electrical properties. e.g., low leakage current, high breakdown voltage etc. By the analysis of Tof-SIMS and XRR, we could observe the several changes of physical characteristics such as the reduction of impurities (H, N etc.), the increase of oxide density, and the improvement of oxide surface roughness. We found out the appropriate treatment condition to be able to densify oxide layer without the addition of ONO Equivalent Oxide Thickness (EOT). The LP-CVD SiO2 prepared by plasma oxidation was used for the ONO IPD of 50nm NAND flash device and also compared with the conventional LP-CVD SiO2 in the aspect of the IPD reliability.

An asymmetric dual gate poly-Si thin film transistors (TFTs), which is consist a long-gate TFT and a short-gate TFT, were fabricated in order to suppress the kink current and increase the reliability. The long-gate TFT operates in a linear regime and limits the total current flow by its current operation region. The asymmetric dual-gate does not exhibit from the kink current in a high drain bias due to the distribution of lateral electric field. The asymmetric dual-gate structure improves kink-free characteristics compared with conventional single and dual-gate TFTs. The hot-carrier stress reliability is successfully improved due to kink current suppression.

In this investigation, 22 cloned male piglets were obtained by male fetal fibroblast-cell-derived nuclear transfer. Eighteen of the cloned animals died. The two cell lines did not differ significantly with regard to efficiency of live piglet production. The gross anatomy of the testes of male piglets that died was normal. However, one piglet displayed Leydig cell hypoplasia (LCH). No anatomical defects were detected in the testes of other cloned male piglets. TUNEL analysis of the testis with LCH revealed significant apoptosis in the Leydig cells, while apoptosis was rarely detected in Sertoli cells and spermatogonia. In contrast, testes from the remaining 17 piglets that died appeared normal in size, and their Sertoli and Leydig cell numbers were comparable to those in control piglet testes. Although cloned piglets were derived from fibroblasts obtained from the same fetus, phenotypic instability between cells used for the production of somatic cell cloned piglets suggests that abnormalities in male cloned piglets are caused not by technical problems and/or reprogramming effects, but rather by epigenetically and/or genetically damaged cell-specific effects.

We propose a short channel gate overlapped lightly doped drain (GOLDD) poly-Si TFT employing 45° tilt implant for source and drain (S/D) regions without any additional ion doping or mask. Oblique-incident ELA activation is performed to activate both n+ S/D and n- LDD regions as well as cure junction defects. The proposed poly-Si TFT can suppress the anomalous leakage current, and exhibit the better reliability against the hot-carrier stress.

The electrical characteristics of SiH4-based PECVD gate oxide have been investigated with respect to gate oxide integrity (GOI) and its reliability. It was found that the GOI of poly-Si TFT integrated on glass substrate strongly depended on the charge trapping and deep level interface states generation under Fowler-Nordheim stress (FNS). By applying elevated temperature postanneal without vacuum break after the gate oxide deposition, highly reliable gate oxide was obtained. Under FNS, ID-VG curve showed severe shift and degradation of subthreshold slope, which were reduced by adopting post-annealed gate oxide. Besides, the TFT with post-annealed gate oxide showed around 10 times higher charge to breakdown than that of as-deposited gate oxide. Charge to breakdown of MOS capacitors were also studied. By applying post-annealed gate oxide, charge to breakdown drastically improved, which could be explained by reduced charge trapping under FNS.

We have successfully obtained large lateral grains with well-controlled grain boundary. The proposed excimer laser annealing (ELA) method produces 2-dimensionally controlled grain growth because the temperature gradient is induced in two directions. Along the channel direction, the floating active structure produces large thermal gradient due to very low thermal conductivity of the air-gap. Along the perpendicular direction to the channel, the surface tension effect also produces thermal gradient. The proposed ELA method can control the grain boundary perpendicular and parallel to current path with only one laser irradiation.

Incomplete recrystallized junction defects of self-aligned, excimer laser annealed polycrystalline silicon (poly-Si) thin film transistor (TFT) was investigated by high-resolution transmission electron microscopy (HR-TEM). TEM observation and simulation result verify that the laser irradiation intensity decreased remarkably at the junction due to diffraction of laser beam at gate electrode edge. We proposed oblique-incidence excimer laser annealing method and successfully eliminated the residual junction defects.

For a diffusion barrier against Cu, tantalum nitride (TaN) films have been successfully deposited by both conventional thermal atomic layer deposition (ALD) and plasma assisted atomic layer deposition (PAALD), using pentakis (ethylmethlyamino) tantalum (PEMAT) and ammonia (NH3) as precursors. The growth rate of PAALD TaN at substrate temperature 250° was slightly higher than that of ALD TaN (0.80 Å/cycle for PAALD and 0.75 Å/cycle for ALD). Density of TaN films deposited by PAALD was as high as 11.0 g/cm3, considerably higher compared to the value of 8.3 g/cm3 obtained by ALD. The N: Ta ratio for ALD TaN was 44: 37 in composition and the film contained approximately 8∼10 atomic % carbon and 11 atomic % oxygen impurities. On the other hand, the ratio for PAALD TaN layers was 47: 44 and the respective carbon and oxygen contents of TaN layers decreased to 3 atomic % and 4 atomic %. The stability of 10 nm-thick TaN films as a Cu diffusion barrier was tested through thermal annealing for 30 minutes in N2 ambient and characterized by XRD, which proves the PAALD deposited TaN film to maintain better barrier properties against Cu below 800°.

Residual ion implantation damage at source/drain junctions of excimer laser annealed polycrystalline silicon (poly-Si) thin film transistor (TFT) was investigated by high-resolution transmission electron microscopy (HR-TEM). Cross-sectional TEM observation showed that XeCl excimer laser (λ=308 nm) energy decreased considerably at the source/drain junctions of top-gated poly-Si TFT due to laser beam diffraction at the gate electrode edges and that the silicon layer amorphized by ion implantation, was not completely annealed at the juncions. The HR-TEM observation showed severe lattice disorder at the junctions of poly-Si TFT.

A new self-aligned poly-Si TFT has been fabricated by employing a photoresist backside exposure technique. A pre-patterned aluminum (Al) layer on a-Si film not only induces the lateral grain growth (∼1.6 μm) in excimer laser crystallization but also implements the selfalignment of the gate region with the lateral grain region. Photoresist backside exposure through poly-Si film has been successfully performed because crystallized poly-Si has a fairly high UV transmittance. A self-aligned poly-Si TFT with a single grain boundary within the 2 μm channel was successfully fabricated and high on/off current ratio (∼107) was obtained.

The Far-ultraviolet IMaging Spectrograph (FIMS) is a small spectrograph optimized for the observations of diffuse hot interstellar medium in far-ultraviolet wavebands (900–1150Å and 1335–1750Å). The instrument is expected to be sensitive to emission line fluxes an order of magnitude fainter than any previous missions. FIMS is currently under development and is scheduled for launch in 2002.

Anew excimer laser recrystallization method of a-Si film to increase the grain size of poly-Si film has been proposed. Excimer laser energy was locally modulated by being irradiated on stepped substrate with 500 nm deep trench on which a-Si film was deposited. Fairly large poly-Si grains (over 1 µm) were obtained due to lateral thermal gradient which resulted from the laser energy difference on the vertical wall and on the horizontal bottom plane of the trench without altering laser energy density elaborately.

Boron nitride thin films were prepared on Si(100) substrate by CVD. Triethylboron and ammonia were employed as precursors and various operating parameters such as reactor pressure, temperature, feed rates of gases were varied to investigate their effects on deposition rate and film characteristics. Total gas pressure in the reactor was varied from atmospheric to I torr. Deposition temperature was in the range 850 – 1,050 °C. Deposition rate increased with partial pressure of TEB but decreased with total pressure in the reactor. Deposited films were examined with SEM, FTIR, XPS, AES, XRD. Prepared films were BN of turbostratic structure.

The hydrogenation effect was studied in the fabrication of amorphous silicon thin film transistor using APCVD technique. The inverse staggered type a-Si TFTs were fabricated with the deposited a-Si and SiO2 films by the atmospheric pressure (AP) CVD. The field effect mobility of the fabricated a-Si TFT is 0.79 cm2/Vs and threshold voltage is 5.4V after post hydrogenation. These results can be applied to make low cost a-Si TFT array using an in-line APCVD system.

We have studied the preparation and device application of a-Si by atmospheric pressure CVD using disilane. The deposition rate of a-Si increases with the partial pressure of disilane and with the total pressure. The deposition rate of APCVD a-Si is, therefore, very high compared with LPCVD. The photosensitivity of APCVD a-Si is 104 at 100mW/cm2. We have made an inverse staggered type a-Si TFT using SiO2 as a gate insulator. The on/off current ratio and field effect mobility are 105 and 0.19cm2/Vs, respectively.