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Thermal Conductivity Measurement of Cu Thin Films using Radiation Heat Exchange Method

Published online by Cambridge University Press:  01 February 2011

Sang Ryu ,
Youngman Kim  and
Woonam Juhng
Sang Ryu
Affiliation:
rsang@hanmail.net, Chonnam Natioal University, Materials Science & Engineering, 300, YongBong-Dong, Buk-Gu, Gwangju, 500-757, Korea, Republic of, +82-62-530-0080, +82-62-530-1699
Youngman Kim
Affiliation:
kimy@chonnam.ac.kr, Chonnam Natioal University, Materials Science & Engineering, 300, YongBong-Dong, Buk-Gu, Gwangju, 500-757, Korea, Republic of
Woonam Juhng
Affiliation:
wnjuhung@chonnam.ac.kr, Chonnam National University, Mechanical Engineering, 300, YongBong-Dong, Buk-Gu, Gwangju, 500-757, Korea, Republic of
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Abstract

A measurement method of thermal conductivities of Cu thin films was devised from the temperature distributions of substrate surfaces. The substrate was prepared to have a prismatic bar shape, and was deposited with Cu thin films using sputtering. Two metal coated surfaces of specimens were brought into contact to maintain the insulated boundary condition. Specimens were heated with constant temperature at both ends. The temperature distributions were measured from the back surface of substrate using a radiation thermometry.

The thermal conductivities of Cu thin films were found to be much lower than those of bulk materials. Wiedemann-Franz law could be applied to thin films produced in this study. Thermal conductivity was also estimated from the resistivity of thin film and Lorenz number of bulk material.

Keywords

thermal conductivitythin filmCu
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1022: Symposium II – Nanoscale Heat Transport–From Fundamentals to Devices , 2007 , 1022-II06-07
Copyright
Copyright © Materials Research Society 2007

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