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LCP for Microwave Packages and Modules

$130.00 (P)

Part of The Cambridge RF and Microwave Engineering Series

Morgan J. Chen, Kunia Aihara, Cheng Chen, Anh-Vu H. Pham, Hai Ta, Andy C. Chen, Jia-Chi Samual Chieh
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  • Date Published: July 2012
  • availability: Available
  • format: Hardback
  • isbn: 9781107003781

$ 130.00 (P)
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About the Authors
  • A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

    • The first and only book dedicated to RF microelectronic design using LCP
    • Contains original real-world examples using LCP for high performance broadband packaged interconnect, module and system designs
    • Reveals how LCP properties can be leveraged to provide state-of-the-art performance
    • Includes exhaustive design details and describes potential pitfalls to look out for during design and development
    Read more

    Reviews & endorsements

    "These foremost experts have created a compendium on microwave and millimeter-wave applications of LCP in packaging and modules that is clear and comprehensive, starting with materials science and theory, going through wide-ranging and current practical applications, and even covering all of the practical reliability aspects. Moreover, they have revealed in detail a host of design tricks (such as defected grounds) and advanced circuitry (such as a folded Marchand balun with a broadband even-mode matching network) that can enhance the designer’s arsenal in general. We have here a valuable text for microwave designers at all levels." - Ed Stoneham, Stoneham Innovations

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    Product details

    • Date Published: July 2012
    • format: Hardback
    • isbn: 9781107003781
    • length: 266 pages
    • dimensions: 253 x 176 x 16 mm
    • weight: 0.68kg
    • contains: 227 b/w illus. 24 tables
    • availability: Available
  • Table of Contents

    1. Introduction
    2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham
    3. Fabrication techniques for processing LCP laminates
    4. LCP for wafer level chip scale MEMS
    5. LCP for surface mount interconnects, packages, and modules
    6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham
    7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham
    8. LCP reliability.

  • Authors

    Anh-Vu H. Pham, University of California, Davis
    Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012.

    Morgan J. Chen, Huawei Technologies
    Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

    Kunia Aihara, Hirose Electric
    Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

    Contributors

    Morgan J. Chen, Kunia Aihara, Cheng Chen, Anh-Vu H. Pham, Hai Ta, Andy C. Chen, Jia-Chi Samual Chieh

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