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A wide variety of applications ranging from microelectronics to turbines for propulsion and power generation rely on films, coatings, and multilayers to improve performance. As such, the ability to predict coating failure - such as delamination (debonding), mud-cracking, blistering, crack kinking, and the like - is critical to component design and development. This work compiles and organizes decades of research that established the theoretical foundation for predicting such failure mechanisms, and clearly outlines the methodology needed to predict performance. Detailed coverage of cracking in multilayers is provided, with an emphasis on the role of differences in thermoelastic properties between the layers. The comprehensive theoretical foundation of the book is complemented by easy-to-use analysis codes designed to empower novices with the tools needed to simulate cracking; these codes enable not only precise quantitative reproduction of results presented graphically in the literature, but also the generation of new results for more complex multilayered systems.Read more
- Suitable as a reference for key results for those familiar with the concepts but not experts in the specifics
- Suitable for experts in the field teaching graduate courses on the subject or as reference for coverage in broader courses
- Users can obtain precise numbers typically reported only graphically in the literature
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- Date Published: March 2017
- format: Hardback
- isbn: 9781107131866
- length: 288 pages
- dimensions: 260 x 182 x 17 mm
- weight: 0.74kg
- availability: In stock
Table of Contents
2. Key mechanics concepts
3. Fracture mechanics
6. Channeling/tunneling cracks
8. Penetration vs deflection vs arrest
9. Edge and corner interface cracks
10. Buckling delamination
11. Thin strips (patterned lines)
12. Steady-state temperature gradients
13. Cracking due to temperature transients
14. Software for steady-state delamination
15. Software for transient behavior
16. FEA software for multilayers
17. Convergence and benchmarks with LS-FEA.
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