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Interfacial-shear strength of the perfluorocyclobutane films on silicon

Published online by Cambridge University Press:  01 July 2006

Srinivasa Rao Boddapati ,
Hong Ma ,
Rajendra K. Bordia  and
Alex K-Y. Jen
Srinivasa Rao Boddapati*
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Hong Ma
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Rajendra K. Bordia
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Alex K-Y. Jen
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
*
a) Address all correspondence to this author. e-mail: bsrao@u.washington.edu
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Abstract

The debonding behavior of perfluorocyclobutane (PFCB) films on silicon (Si) has been investigated using Vickers indentation as a function of cure temperature and film thickness. PFCB films on Si were processed by spin coating (1–4 μm) and solution casting (20–60 μm). The interfacial shear strength of solution-cast PFCB films was independent of film thickness. The interfacial shear strength increased with cure temperature. The PFCB/Si cured at 225 °C exhibited interfacial shear strength of 123 MPa, and the strength increased to 163 MPa when the cure temperature was raised to 275 °C. The increase in interfacial-shear strength with temperature has been attributed to the increase in the density of bonds between PFCB and Si due to an increase in the density of crosslinks. Spin-coated films exhibited cracking due to the penetration of the indenter into the substrate, and the extent of cracking increased with the load.

Keywords

FilmPolymerStrength
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 7 , July 2006 , pp. 1759 - 1769
Copyright
Copyright © Materials Research Society 2006

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