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Design and Reliability Assessment of Novel 3D-IC Packaging

Published online by Cambridge University Press:  09 September 2016

Y.-F. Su ,
K.-N. Chiang  and
Steven Y. Liang
Y.-F. Su
Affiliation:
Advanced Micro-system Packaging and Nano-Mechanics Research LaboratoryDeptment of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
K.-N. Chiang*
Affiliation:
Advanced Micro-system Packaging and Nano-Mechanics Research LaboratoryDeptment of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
Steven Y. Liang
Affiliation:
George W. Woodruff School of Mechanical EngineeringGeorgia Institute of TechnologyAtlanta, U.S.A.
*
*Corresponding author (knchiang@pme.nthu.edu.tw)

Abstract

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Presently, physical limitations are restricting the development of the microelectronic industry driven by Moore's law. To achieve high-performance, small form factor, and lightweight applications, new electronic packaging methods have exceeded Moore's law. This research proposes a double-chip stacking structure in an embedded fan-out wafer-level packaging with double-sided interconnections. The overall reliability of the solder joints and redistributed lines is assessed through finite element analysis. The application of soft lamination material and selection of a carrier material whose coefficient of thermal expansion (CTE) is close to that of the printed circuit board can effectively enhance the reliability of solder joints over more than 1,000 cycles. A trace/pad junction whose direction is parallel to the major direction of the CTE mismatch is recommended, and the curved portion of trace lines can absorb the expansion of metal lines and filler material. Design-on-simulation methodology is necessary to develop novel packaging structures in the electronic packaging industry.

Keywords

Fan-out wafer-level packagingFinite element analysisLife prediction model
Type
Research Article
Information
Journal of Mechanics , Volume 33 , Issue 2 , April 2017 , pp. 193 - 203
Copyright
Copyright © The Society of Theoretical and Applied Mechanics 2017 

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