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Fatigue Crack Growth Behavior of Small Sn-Bi-Ag Solder Joints

Published online by Cambridge University Press:  21 February 2011

Tao Liu ,
M. A. Korhonen ,
S. Ting ,
D. Kim  and
C.-Y. Li
Tao Liu
Affiliation:
Department of Materials Science and Engineering, Cornell University Bard Hall, Ithaca, NY 14853
M. A. Korhonen
Affiliation:
Department of Materials Science and Engineering, Cornell University Bard Hall, Ithaca, NY 14853
S. Ting
Affiliation:
Department of Materials Science and Engineering, Cornell University Bard Hall, Ithaca, NY 14853
D. Kim
Affiliation:
Department of Materials Science and Engineering, Cornell University Bard Hall, Ithaca, NY 14853
C.-Y. Li
Affiliation:
Department of Materials Science and Engineering, Cornell University Bard Hall, Ithaca, NY 14853
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Abstract

Reliability of solder interconnects is normally characterized by extrapolation of bulk solder reliability data, such as crack growth measurements of solder materials in the bulk form. In the present study, experimental evidence will be presented to show that crack growth, which is the most commonly observed failure mode in small solder joints strongly depends on the size and shape of the joint cross-section. Furthermore, the crack growth rate can be appropriately correlated to the size of the intense plastic yielding zone at the crack tip using a plastic decohesion argument.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 177
Copyright
Copyright © Materials Research Society 1995

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References

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