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High Temperature Tensile Behavior Of Free-Standing Gold Films

Published online by Cambridge University Press:  10 February 2011

R. Emery ,
C. Simons ,
B. Mazin  and
G. L. Povirk
R. Emery
Affiliation:
Department of Mechanical Engineering, Yale University, New Haven, CT 06520, gary.povirk@yale.edu
C. Simons
Affiliation:
Department of Mechanical Engineering, Yale University, New Haven, CT 06520, gary.povirk@yale.edu
B. Mazin
Affiliation:
Department of Mechanical Engineering, Yale University, New Haven, CT 06520, gary.povirk@yale.edu
G. L. Povirk
Affiliation:
Department of Mechanical Engineering, Yale University, New Haven, CT 06520, gary.povirk@yale.edu
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Abstract

A method for tensile testing thin films at elevated temperatures is presented. Freestanding tensile specimens were prepared by evaporating 2.1 μm of gold onto a patterned oxidized silicon wafer. Tensile tests were performed at various temperatures up to 600°C. The ultimate tensile strengths of the films decreased as temperature increased, and ductility increased with increasing temperature. Films tested at high temperatures (≥ 400 °C) exhibited significant strain rate-dependence, while films tested at low temperatures (≤ 200 °C) were found to be virtually rate-independent. At higher temperatures and strain rates, stress-enhanced grain growth was observed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 505 , 1997 , 57
Copyright
Copyright © Materials Research Society 1998

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