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A Method for Independent Measurement of Elastic Modulus and Poisson's Ratio of Diamond-Like Carbon Films

Published online by Cambridge University Press:  10 February 2011

Kwang Yong Eun
Affiliation:
Thin Film Technology Research Center, Korea Institute of Science and Technology, P. 0. Box 131, Cheongryang, Seoul, 130-650, Korea
Jun Hee HAN
Affiliation:
Materials Evaluation Center, Korea Research Institute of Standards and Science, P. 0. Box 102, Yusung, Taejon, 305-600, Korea
Dae-Hong Ko
Affiliation:
Department of Ceramic Engineering, Yonsei University, Seoul, 120-701, Korea
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Abstract

A simple method to measure the elastic modulus and Poisson's ratio of diamond-like carbon (DLC) films deposited on Si wafer was suggested. This method involved etching a side of Si substrate using the DLC film as an etching mask. The edge of DLC overhang free from constraint of Si substrate exhibited periodic sinusoidal shape. By measuring the amplitude and the wavelength of the sinusoidal edge, we can determine the strain of the film required to adhere to the substrate. Combined with independent stress measurement by laser reflection method, this method allows calculation of the biaxial elastic modulus, E/(1 − v), where E is the elastic modulus and v Poisson's ratio of the DLC films. By comparing the biaxial elastic modulus with plane-strain modulus, E/(1 −v2), measured by nano-indentation, we could further determine the elastic modulus and Poisson's ratio, independently. This method was employed to measure the mechanical properties of DLC films deposited by C6H6 r.f. glow discharge at the deposition pressure 1.33 Pa. The elastic modulus, E, increased from 94 to 128 GPa as the negative bias voltage increased from 400 to 550 V. Poisson's ratio was estimated to be about 0.22 in this bias voltage range. For the negative bias voltages less than 400 V, however, the present method resulted in negative Poisson's ratio. The limitation of the present method was discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1.Fujimori, N., New Diamond, 3, 20 (1989).Google Scholar
2.Imai, T., Nakahata, H. and Fujimori, N., U. S. Patent, 4,952,832 (1990).Google Scholar
3.Angus, J. C., Koidl, P. and Domitz, S., in Plasma Deposited Thin Films, edited by Mort, J. and Jansen, F. (CRC, Boca Raton, FL, 1986), p. 89.Google Scholar
4.Oliver, W. C. and Pharr, G. M., J. Mater. Res., 7, 1564 (1992).Google Scholar
5.Sandercook, J. R., in Light Scattering in Solids, edited by Cardona, M. and Güntherodt, G., Topics in Applied Physics Vol.51 (Springer, Berlin, 1982), p. 173.Google Scholar
6.Scheider, D., Scheibe, H.-J., Schwarz, T. and Hess, P., Diamond Relat. Mater., 2, 92 (1992).Google Scholar
7.Khakani, M. A. El, Chaker, M., Jean, A., Boily, S., Kieffer, J. C., O'Hern, M. E., Ravet, M. F. and Rousseaux, F., J. Mater. Res., 9, 96 (1994).Google Scholar
8.Berry, B. S., Pritchet, W. C., Cuomo, J. J., Guarnieri, C. R. and Whitehair, S. J., Appl. Phys. Lett., 57, 32 (1990).Google Scholar
9.Lee, K.-R., Baik, Y.-J. and Eun, K. Y., in Thin Films: Stresses and Mechanical Properties IV, edited by Townsend, P. H., Weihs, T. P., Sanchez, J. E. Jr., and Borgesen, P. (Mater. Res. Soc. Proc. 308, Pittsburgeh, PA 1193), p. 101106.Google Scholar
10.Borden, P. G., Appl. Phys. Lett., 36, 829 (1980).Google Scholar
11.Howe, R. T. and Muller, R. S., J. Appl. Phys., 54, 4674 (1983).Google Scholar
12.Brenner, A and Senderoff, S., J. Res. Natl. Bur. Stand., 42, 105 (1949).Google Scholar
13.Lee, K.-R., Baik, Y.-J. and Eun, K. Y., Dia. Rel. Mater. 3, 1230 (1994).Google Scholar
14.Cho, S. -J., Lee, K.-R., Eun, K. Y., Han, J. and Ko, D.-H., submitted to Thin Solid Films (1997).Google Scholar
15.Jiang, X., Riechelt, K. and Stritzker, B., J. Appl. Phys., 68, 1018 (1990).Google Scholar
16.Pivin, J. C., Thin Solid Films, 229, 83 (1993).Google Scholar