Hostname: page-component-848d4c4894-xm8r8 Total loading time: 0 Render date: 2024-06-13T12:39:15.414Z Has data issue: false hasContentIssue false

Preparation and Characterization of Porous Collagen Membranes on Silicon

Published online by Cambridge University Press:  11 February 2011

Lori A. Lepak
Affiliation:
Cornell University, Dept. of Chemistry and Chemical Biology, Ithaca NY 14853
Troy Richards
Affiliation:
Cornell University, Dept. of Electrical and Computer Engineering
Nancy Guillen
Affiliation:
Research Experience for Undergraduates (REU) Program
Michelle Caggana
Affiliation:
Wadsworth Center, Empire State Plaza, Albany NY 12201
James N. Turner
Affiliation:
Wadsworth Center, Empire State Plaza, Albany NY 12201
Michael G. Spencer
Affiliation:
Cornell University, Dept. of Electrical and Computer Engineering
Get access

Abstract

Advances in biotechnology in the past decade have raised the possibility of fabricating biocompatible, porous membranes for molecular sieving and dialysis separations of particles sized 20–50 nm or less. As a prerequisite for such applications, we demonstrate that thin films (∼ 400 nm) of monomeric bovine dermal collagen spin-deposited on a silicon substrate are patternable using standard semiconductor microlithographic processing techniques. Patterning via liftoff has reliably produced square features as small as 10–25 μm laterally, and 50 nm thick, in initial experiments.

HVEM (high vacuum electron microscope) images of these collagen membranes have revealed typical pore sizes ranging from 1–100 nm. Through-membrane diffusion of chromophores spanning this size range was quantified via UV/vis spectrometry. These studies revealed that a 400 nm thick collagen membrane crosslinked with 0.02% glutaraldehyde rejected detectable quantities of methyl orange dye (MW 327) for at least 48 hours, while a 100 nm thick layer admitted methyl orange in under 30 minutes. DNA has been demonstrated to pass through a 100 nm thick collagen layer more slowly than through a bare through-etched control wafer.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Nucci, J.; Neves, H.; Shacham, Y.; Eisenbraun, E.; Zheng, B.; Kaloyeros, A. In-situ analysis of the microstructure of thermally treated thin copper films In: Rodbell, K.P. Filter, W.F. Frost, H.J. Ho, P.S.; Materials Reliability in Microelectronics III Symposium; Pittsburgh, PA, USA: Mater. Res. Soc, 1993, xi+496 p. (377–82)Google Scholar
[2] Russo, A.P.; Martin, D.; Shain, W.; Turner, J.N. Microfluidic Separations Using Spin-on Polymer Membranes. Annual Meeting Microscale Separations in Biotechnology, 2002, acceptedGoogle Scholar