Hostname: page-component-848d4c4894-2pzkn Total loading time: 0 Render date: 2024-06-01T14:09:13.317Z Has data issue: false hasContentIssue false

Preparation and Characterization of Tin Oxide Films by Ion-Assisted Deposition

Published online by Cambridge University Press:  03 September 2012

W. K. Choi
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
J. S. Cho
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
S. K. Song
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
Y. T. Kim
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
K. H. Yoon
Affiliation:
Department of Ceramic Engineering, Yonsei University, Sudaemoon Ku, Shincheon Dong, Seoul 120–749, Korea
H.-J. Jung
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
S. K. Koh
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
Get access

Abstract

Undoped tin oxide films were grown on Si substrates by a reactive ion-assisted deposition technique in which oxygen ions were irradiated on depositing Sn particles. In order to investigate the oxidation from SnO to SnO2, the effects of initial oxygen contents and heat treatment on the final crystalline structure of tin oxide films were thoroughly examined. Oxygen to Sn metal ratio (No/Nsn) of as-deposited films were controlled from 1.1 to 1.9 by varying the relative arrival ratio (F) of oxygen ion to Sn particle from 0.025 to 0.1. Heat treatment was carried out in two different ways; one was post vacuum-annealing at 400 ∼ 600°C and the other was in-situ annealing 400 ∼ 500°C. Crystalline structure of as-deposited tin oxide films at room temperature was amorphous. After post-annealing at 400°C, only SnO phase was found below No/Nsn= 1.6 in x-ray diffraction and crystalline structure of the films comprising higher oxygen contents still appeared to be amorphous. Even though the films still showed SnO phase until Γ50 after 500°C post-annealing, however, mixed structures of SnO, SnO2, and intermediate Sn2O3/Sn3O4 were observed for the films Γ75 and Γ100 with higher oxygen contents. At 600°C annealing, perfect SnO2 phase was attained for the films having No/Nsn=1.9. On the other hand, pure polycrystalline SnO2 films could be obtained by in-situ annealing at low temperature. The values of No/Nsn and the chemical shifts with the variation of oxidation were carefully determined by the comparison of Sn MNN and O KLL Auger transitions. Surface microstructure of deposited films was also analyzed using a scanning electron microscopy (SEM) and an atomic force microscope (AFM).

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Coutts, T.J., Liand, X., and Cessert, T.A., IEEE Electron. Lett. 26, 660 (1990).Google Scholar
2. Maudes, J.S. and Rodriguez, T., Thin Solid Films 69, 183 (1980).Google Scholar
3. Stierna, B. and Granqvist, C.G., Appl. Opt. 29, 447 (1990).Google Scholar
4. Garner, J.W., Shurmer, H.V., and Corcoran, P., Sensors and Actuators B 4, 117 (1991).Google Scholar
5. Martinelli, G. and Carotta, M.C., Sensors and Actuators B 15–16, 363 (1993).Google Scholar
6. Geurts, J., Rau, S., Ritcher, W., and Schmitte, F.J., Thin Solid Films, 121, 217 (1984).Google Scholar
7. Uen, T.M.. Huang, K.F., Chen, M.S., and Gou, Y.S., Thin Solid Films 158, 69 (1988).Google Scholar
8. Leja, E., Pisarkiewicz, T., and Kolodziej, A., Thin Solid Films 67, 45 (1980).Google Scholar
9. Stedile, F.C., de Barros, B.A.S. Jr, Leite, C.V. Barros, Freire, F.L. Jr, Baumvol, I.J.R., and Schreiner, W.H., Thin Soild Films 170, 285 (1989).Google Scholar
10. Soares, M.R., Dionísio, P.H., Baumvol, I.J., and Schreiner, W.H., Thin Solid Films 214, 6 (1992).Google Scholar
11. Marifier, J.S., Szepessy, L., Bresse, J.F., Perotin, M., and Stuck, R., Mat. Res. Bull. 14, 109 (1979).Google Scholar
12. Park, K.-H. and Park, T.S., J. Kor. Phys. Soc. 12, 394 (1974).Google Scholar
13. Liu, D., Wang, Q., Chang, H.L.M. and Chen, H., J. Mater. Res. 10, 1516 (1995).Google Scholar
14. Ivashchenco, A.I., Karyaev, E.V., Khoroshun, I.V., Kiosse, G.A., Moshnyaga, V.T., and Petrenco, P.A, Thin Solid Films, 263, 122 (1995).Google Scholar
15. Reddy, M.H.M., Jawalekar, S.R., and Chandorkar, A.N., Thin Solid Films 169, 117 (1989).Google Scholar
16. Choi, W. K, Koh, S.K., and Jung, H.-J., J. Vac. Sci. Technol. A 14, 359 (1996).Google Scholar
17. Choi, W K., Song, S K., Cho, J.S., Jung, H.-J., and Koh, S.K., Mat. Res. Soc. Symp. Proc. 396, 617 (1996).Google Scholar
18. Robin, J. L, Pro. Phys. Soc. 79, 119 (1962).Google Scholar
19. Sen, S.K., Sen, S., and Bauer, C.L., Thin Solid Films, 82, 157 (1981).Google Scholar